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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
9-1437530-4CONN SOCKET SIP 11POS |
2,243 | 0.00 |
RFQ |
Datasheet |
Bulk | 500 | Obsolete | SIP | 11 (1 x 11) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | Beryllium Copper | Thermoplastic |
|
|
9-1437530-5CONN SOCKET SIP 12POS |
3,290 | 0.00 |
RFQ |
Datasheet |
Bulk | 500 | Obsolete | SIP | 12 (1 x 12) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | Beryllium Copper | Thermoplastic |
|
824-AG32DCONN IC DIP SOCKET 24POS TINLEAD |
3,717 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
|
1-1437538-6CONN IC DIP SOCKET 28POS GOLD |
2,718 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
1-390261-5CONN IC DIP SOCKET 18POS TIN |
2,437 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - |
|
|
1437504-7CONN TRANSIST TO-5 8POS GOLD |
2,032 | 0.00 |
RFQ |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | |
|
|
2-1437531-5CONN IC DIP SOCKET 14POS TIN |
2,849 | 0.00 |
RFQ |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper Alloy | - | |
|
|
2-1437542-2CONN IC DIP SOCKET 18POS GOLD |
2,150 | 0.00 |
RFQ |
Datasheet |
- | 700 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy |
|
|
2-382515-3CONN IC DIP SOCKET 20POS TIN |
2,200 | 0.00 |
RFQ |
Datasheet |
Box | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
8080-1G13CONN TRANSIST TO-3 3POS TIN |
2,554 | 0.00 |
RFQ |
Datasheet |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
3-1437530-1CONN SOCKET SIP 14POS GOLD |
2,167 | 0.00 |
RFQ |
Datasheet |
Bulk | 500 | Obsolete | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic |
|
|
3-1437530-3CONN SOCKET SIP 16POS GOLD |
3,172 | 0.00 |
RFQ |
Datasheet |
Bulk | 500 | Obsolete | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic |
|
|
520-AG12D-ESCONN IC DIP SOCKET 20POS TINLEAD |
3,362 | 0.00 |
RFQ |
Datasheet |
Bulk | 500 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
|
8080-1G25CONN TRANSIST TO-3 3POS GOLD |
3,293 | 0.00 |
RFQ |
Datasheet |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
4-1437508-0CONN TRANSIST TO-5 8POS GOLD |
2,378 | 11.29 |
RFQ |
Bulk,Bulk | 8058 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | |
|
8059-2G8CONN TRANSIST TO-5 8POS GOLD |
2,012 | 0.00 |
RFQ |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | |
|
|
4-1437530-7CONN SOCKET SIP 3POS GOLD |
2,927 | 0.00 |
RFQ |
Datasheet |
Bulk | 500 | Obsolete | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic |
|
|
516-AG10D-ESLCONN IC DIP SOCKET 16POS GOLD |
2,598 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
|
|
4-1437531-9CONN IC DIP SOCKET 16POS TIN |
2,210 | 0.00 |
RFQ |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Copper Alloy | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Copper Alloy | - | |
|
|
4-1437538-9CONN IC DIP SOCKET 64POS TIN |
3,254 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Tin | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
