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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-1437539-0CONN IC DIP SOCKET 14POS TIN |
2,650 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
2-1437540-2CONN IC DIP SOCKET 32POS GOLD |
2,615 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
2-1437542-9CONN IC DIP SOCKET 20POS GOLD |
3,122 | 0.00 |
RFQ |
Datasheet |
- | 700 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy |
|
816-AG11D-ESL-LFCONN IC DIP SOCKET 16POS GOLD |
3,766 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
2-210735-5CONN SOCKET SIP 25POS TIN-LEAD |
3,464 | 0.00 |
RFQ |
Bulk | - | Obsolete | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | - | - | Thermoplastic | |
|
|
2-382467-1CONN IC DIP SOCKET 28POS TIN |
2,023 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
2-641610-2CONN IC DIP SOCKET 16POS GOLD |
3,723 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - |
|
|
210748-5CONN SOCKET PGA 6POS TIN-LEAD |
2,547 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | PGA | 6 (2 x 3) | 0.100 (2.54mm) | Tin-Lead | 196.9µin (5.00µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Thermoplastic, Polyester, Glass Filled |
|
|
3-1437504-6CONN TRANSIST TO-3 3POS GOLD |
3,563 | 0.00 |
RFQ |
Datasheet |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | 50.0µin (1.27µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | 50.0µin (1.27µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
3-1437508-9CONN TRANSIST TO-5 8POS GOLD |
2,177 | 0.00 |
RFQ |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | |
|
|
3-1437530-2CONN SOCKET SIP 15POS |
2,194 | 0.00 |
RFQ |
Datasheet |
Bulk | 500 | Obsolete | SIP | 15 (1 x 15) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | Beryllium Copper | Thermoplastic |
|
|
3-1437531-7CONN IC DIP SOCKET 14POS |
2,441 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | - | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Copper Alloy | - |
|
|
3-1437532-4CONN IC DIP SOCKET 28POS GOLD |
3,624 | 0.00 |
RFQ |
Datasheet |
- | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | - | - | - |
|
|
3-1437537-0CONN IC DIP SOCKET 14POS TINLEAD |
2,794 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
3-1437537-5CONN IC DIP SOCKET 14POS GOLD |
3,099 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
832-AG11D-ESL-LFCONN IC DIP SOCKET 32POS GOLD |
3,115 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
|
347846-3CONN IC DIP SOCKET 28POS TINLEAD |
2,276 | 0.00 |
RFQ |
- | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin-Lead | - | - | Through Hole, Right Angle, Horizontal | Open Frame | - | - | - | - | - | - | |
|
|
390263-7CONN IC DIP SOCKET 24POS TINLEAD |
2,034 | 0.00 |
RFQ |
Datasheet |
Box | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | - |
|
|
4-1437504-5CONN TRANSIST TO-3 3POS GOLD |
3,342 | 0.00 |
RFQ |
Datasheet |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
8080-1G39CONN TRANSIST TO-3 3POS GOLD |
2,607 | 0.00 |
RFQ |
Datasheet |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
