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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
32-6552-18 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	3,980	118.06	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
32-6553-18 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	2,369	118.06	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
32-3554-18 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	3,903	118.06	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
40-6554-18 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2,409	140.30	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
40-3551-18 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2,338	140.30	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
40-3552-18 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2,460	140.30	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
40-3553-18 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	3,287	140.30	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
42-6554-18 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	3,053	147.15	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
36-3574-18 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	3,406	149.38	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-3575-18 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	3,870	149.38	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6574-18 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	3,133	149.38	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6575-18 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	2,056	149.38	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3552-18 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,882	154.00	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
44-3553-18 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,239	154.00	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
44-6551-18 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,552	154.00	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
44-6552-18 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,042	154.00	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
441-PGG21001-40 CONN SOCKET PGA GOLD Aries Electronics	2,553	87.81	RFQ	PDF	Bulk	PGG	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
169-PLS13001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,637	88.49	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
235-3019-02-0602 CONN ZIG-ZAG ZIF 35POS GOLD 3M	3,530	85.35	RFQ	PDF	Bulk	Textool™	Active	Zig-Zag, ZIF (ZIP)	35 (1 x 17, 1 x 18)	0.050 (1.27mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
96-PRS14024-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,736	88.99	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)