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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-13-400-20-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,677	83.68	RFQ	PDF	Bulk	510	Active	PGA	400 (20 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-400-20-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,151	83.68	RFQ	PDF	Bulk	510	Active	PGA	400 (20 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-PLS13009-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,723	83.98	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
124-PRS13009-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,162	83.98	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
112-PRS21028-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,643	84.03	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
144-PLS12001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,727	84.10	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
144-PRS12001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,707	84.10	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
128-PLS12023-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,352	84.70	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
128-PLS13078-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,642	84.70	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
128-PRS13078-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,154	84.70	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
518-77-652M35-001105 CONN SOCKET PGA 652POS GOLD Preci-Dip	2,845	81.32	RFQ	PDF	Bulk	518	Active	PGA	652 (35 x 35)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
234-3034-02-0602 CONN ZIG-ZAG ZIF 34POS GOLD 3M	2,763	81.56	RFQ	PDF	Bulk	Textool™	Active	Zig-Zag, ZIF (ZIP)	34 (2 x 17)	0.050 (1.27mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
518-77-652M35-001106 CONN SOCKET PGA 652POS GOLD Preci-Dip	3,277	82.83	RFQ	PDF	Bulk	518	Active	PGA	652 (35 x 35)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
64-PLS16016-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,098	86.38	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
64-PRS16016-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,660	86.38	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
101-PLS14030-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,006	86.43	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
101-PRS14030-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,048	86.43	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
558-10-652M35-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	2,223	83.43	RFQ	PDF	Bulk	558	Active	BGA	652 (35 x 35)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
144-PRS13095-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,969	87.48	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
32-6551-18 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	3,177	118.06	RFQ	-	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled