Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors

Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
612-43-652-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2,614	20.30	RFQ	PDF	Tube	612	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-652-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2,461	20.30	RFQ	PDF	Tube	612	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-264-41-001000 SOCKET CARRIER DUAL INLINE 64POS Mill-Max Manufacturing Corp.	2,462	20.33	RFQ	PDF	Tube	714	Active	DIP, 0.1 (2.54mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
322-93-164-41-001000 SOCKET 2 LEVEL WRAPOST SIP 64POS Mill-Max Manufacturing Corp.	2,928	20.33	RFQ	PDF	Tube	322	Active	SIP	64 (1 x 64)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,253	20.34	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-91-328-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,481	20.34	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-91-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,645	20.34	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
115-44-420-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,785	20.34	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
517-83-321-19-121111 CONN SOCKET PGA 321POS GOLD Preci-Dip	3,987	19.20	RFQ	PDF	Bulk	517	Active	PGA	321 (19 x 19)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-964-31-002000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2,583	20.35	RFQ	PDF	Tube	614	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-964-31-002000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2,952	20.35	RFQ	PDF	Tube	614	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
712-93-164-41-001000 SOCKET CARRIER SIP 64POS Mill-Max Manufacturing Corp.	3,011	20.35	RFQ	PDF	Tube	712	Active	SIP	64 (1 x 64)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-316-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,199	20.36	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
115-93-316-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,964	20.36	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
18-810-90T CONN IC DIP SOCKET 18POS TIN Aries Electronics	3,222	20.36	RFQ	PDF	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
40-3574-10 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	2,220	20.37	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6570-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	3,430	20.37	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6572-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	2,493	20.37	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3570-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	2,176	20.37	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3571-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	3,401	20.37	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled