Categories

Sockets for ICs, Transistors(21991)

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-44-432-61-001000

110-44-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,097 20.18
RFQ
- Tube * Active - - - - - - - - - - - - - -
110-99-432-61-001000

110-99-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,326 20.18
RFQ
- Tube * Active - - - - - - - - - - - - - -
116-43-210-61-008000

116-43-210-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,340 20.19
RFQ
- Tube * Active - - - - - - - - - - - - - -
116-93-210-61-008000

116-93-210-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,722 20.19
RFQ
- Tube * Active - - - - - - - - - - - - - -
510-91-022-05-001001

510-91-022-05-001001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,590 20.19
RFQ
PDF Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-022-05-001002

510-91-022-05-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,783 20.19
RFQ
PDF Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-022-05-001003

510-91-022-05-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,145 20.19
RFQ
PDF Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
311-13-164-41-001000

311-13-164-41-001000

SOCKET LONG SOLDERTAIL SIP 64POS

Mill-Max Manufacturing Corp.

3,379 20.20
RFQ
- Tube 311 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-308-61-008000

116-43-308-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,457 20.21
RFQ
- Tube * Active - - - - - - - - - - - - - -
116-93-308-61-008000

116-93-308-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,148 20.21
RFQ
- Tube * Active - - - - - - - - - - - - - -
127-43-656-41-002000

127-43-656-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,369 20.21
RFQ
PDF Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-93-656-41-002000

127-93-656-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,403 20.21
RFQ
PDF Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-9503-21

20-9503-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,909 20.21
RFQ
PDF Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-9503-31

20-9503-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,334 20.21
RFQ
PDF Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-20

40-6508-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,943 20.22
RFQ
PDF Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-30

40-6508-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,711 20.22
RFQ
PDF Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-41-952-41-004000

612-41-952-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,728 20.23
RFQ
PDF Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-952-41-004000

612-91-952-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,507 20.23
RFQ
PDF Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-314-61-605000

110-43-314-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,353 20.23
RFQ
- Tube * Active - - - - - - - - - - - - - -
110-93-314-61-605000

110-93-314-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,241 20.23
RFQ
- Tube * Active - - - - - - - - - - - - - -
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