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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
20-3518-10 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3,690	2.05	RFQ	PDF	Tube	518	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
A-CCS 068-Z-T CONN SOCKET PLCC 68POS TIN Assmann WSW Components	6,819	2.07	RFQ	PDF	Tube	-	Active	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)
111-43-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	8,104	2.09	RFQ	PDF	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-1-28-006 CONN IC DIP SOCKET 28POS GOLD CNC Tech	1,555	2.10	RFQ	PDF	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
940-44-032-24-000000 CONN SOCKET PLCC 32POS TIN Mill-Max Manufacturing Corp.	4,426	2.11	RFQ	PDF	Tube	940	Active	PLCC	32 (2 x 7, 2 x 9)	0.100 (2.54mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 40-HZL-TT CONN IC DIP SOCKET 40POS TIN Assmann WSW Components	8,409	2.12	RFQ	PDF	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
1-1814655-1 CONN SOCKET SIP 16POS GOLD TE Connectivity AMP Connectors	4,371	2.12	RFQ	PDF	Bulk	-	Active	SIP	16 (1 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Thermoplastic, Polyester
8444-21B1-RK-TP CONN SOCKET PLCC 44POS TIN 3M	3,496	2.14	RFQ	PDF	Tube	8400	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
940-44-028-24-000000 CONN SOCKET PLCC 28POS TIN Mill-Max Manufacturing Corp.	2,544	2.19	RFQ	PDF	Tube	940	Active	PLCC	28 (4 x 7)	0.100 (2.54mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 20-HZW/TN CONN IC DIP SOCKET 20POS GOLD Assmann WSW Components	3,167	2.21	RFQ	PDF	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
4601 CONN TRANSIST TO-3 3POS TIN Keystone Electronics	2,207	2.26	RFQ	PDF	Bulk	-	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled
18-3518-10 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	1,152	2.29	RFQ	PDF	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
A-CCS 084-Z-T IC PLCC SOCKET 84POS TIN Assmann WSW Components	1,646	2.31	RFQ	PDF	Tube	-	Active	PLCC	84 (4 x 21)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)
8452-21B1-RK-TP CONN SOCKET PLCC 52POS TIN 3M	1,113	2.35	RFQ	PDF	Tube	8400	Active	PLCC	52 (4 x 13)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS 032-G-T CONN SOCKET PLCC 32POS GOLD Assmann WSW Components	1,480	2.36	RFQ	PDF	Tube	-	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
8468-21B1-RK-TR CONN SOCKET PLCC 68POS TIN 3M	1,474	2.99	RFQ	PDF	Tape & Reel (TR),Cut Tape (CT)	8400	Active	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
8452-11B1-RK-TP CONN SOCKET PLCC 52POS TIN 3M	3,723	2.40	RFQ	PDF	Tube	8400	Active	PLCC	52 (4 x 13)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
214-44-320-01-670800 CONN IC DIP SOCKET 20POS TIN Mill-Max Manufacturing Corp.	1,268	2.40	RFQ	PDF	Tube	214	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-87-628-41-001151 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	1,218	1.92	RFQ	-	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, No Center Bar	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 14-HZL/07-TT CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	3,145	2.52	RFQ	PDF	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester