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Sockets for ICs, Transistors(21991)
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
69802-432LFCONN SOCKET PLCC 32POS TIN |
4,424 | 1.79 |
|
Tape & Reel (TR),Cut Tape (CT) | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) | |
|
ICM-642-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 42P |
1,083 | 1.27 |
|
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | |
|
PLCC-28-ATPLCC 28P THROUGH HOLE |
2,226 | 1.28 |
|
Tube | PLCC | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
SA283000CONN IC DIP SOCKET 28POS TIN |
1,184 | 1.32 |
|
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled | |
|
115-43-308-41-003000CONN IC DIP SOCKET 8POS GOLD |
934 | 1.32 |
|
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
8428-21B1-RK-TRCONN SOCKET PLCC 28POS TIN |
3,436 | 2.08 |
|
Tape & Reel (TR),Cut Tape (CT) | 8400 | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | |
|
DILB40P-223TLFCONN IC DIP SOCKET 40POS TIN |
13,916 | 1.36 |
|
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon | |
|
PLCC-44-ATPLCC 44P THROUGH HOLE |
2,349 | 1.36 |
|
Tube | PLCC | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
A-CCS 032-Z-TCONN SOCKET PLCC 32POS TIN |
2,499 | 1.37 |
|
Tube | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) | |
|
4848-6004-CPCONN IC DIP SOCKET 48POS TIN |
1,694 | 1.38 |
|
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | |
|
4848-6000-CPCONN IC DIP SOCKET 48POS TIN |
1,190 | 1.38 |
|
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | |
|
SA286040CONN IC DIP SOCKET 28POS GOLD |
1,704 | 1.39 |
|
Tube | SA | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | |
|
14-3518-10CONN IC DIP SOCKET 14POS GOLD |
1,116 | 1.39 |
|
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
|
111-43-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
2,779 | 1.40 |
|
Tube | 111 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
69802-132LFCONN SOCKET PLCC 32POS TIN |
7,911 | 1.57 |
|
Tube | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) | |
|
69802-032LFCONN SOCKET PLCC 32POS TIN |
4,696 | 1.57 |
|
Tube | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) | |
|
110-41-316-41-001000CONN IC DIP SOCKET 16POS GOLD |
1,380 | 1.58 |
|
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
8420-21B1-RK-TPCONN SOCKET PLCC 20POS TIN |
3,667 | 1.60 |
|
Tube | 8400 | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | |
|
110-87-324-41-001101CONN IC DIP SOCKET 24POS GOLD |
1,052 | 1.29 |
|
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
AR 32-HZL/01-TTCONN IC DIP SOCKET 32POS GOLD |
7,945 | 1.66 |
|
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
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