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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
D0724-42

D0724-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

2,527 0.00

RFQ

D0724-42

Datasheet

Bulk D0 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0806-01

D0806-01

CONN IC DIP SOCKET 6POS GOLD

Harwin Inc.

3,577 0.00

RFQ

D0806-01

Datasheet

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0806-42

D0806-42

CONN IC DIP SOCKET 6POS GOLD

Harwin Inc.

2,304 0.00

RFQ

D0806-42

Datasheet

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95020-42

D95020-42

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

2,787 0.00

RFQ

D95020-42

Datasheet

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95022-42

D95022-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

3,023 0.00

RFQ

D95022-42

Datasheet

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95024-42

D95024-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

2,753 0.00

RFQ

D95024-42

Datasheet

Bulk D95 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95028-42

D95028-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

2,696 0.00

RFQ

D95028-42

Datasheet

Bulk D95 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0808-01

D0808-01

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

3,223 0.00

RFQ

D0808-01

Datasheet

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0814-01

D0814-01

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

2,024 0.00

RFQ

D0814-01

Datasheet

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0814-42

D0814-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

2,454 0.00

RFQ

D0814-42

Datasheet

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0816-01

D0816-01

CONN IC DIP SOCKET 16POS GOLD

Harwin Inc.

2,198 0.00

RFQ

D0816-01

Datasheet

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0818-01

D0818-01

CONN IC DIP SOCKET 18POS GOLD

Harwin Inc.

3,629 0.00

RFQ

D0818-01

Datasheet

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0818-42

D0818-42

CONN IC DIP SOCKET 18POS GOLD

Harwin Inc.

3,551 0.00

RFQ

D0818-42

Datasheet

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0820-01

D0820-01

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

2,869 0.00

RFQ

D0820-01

Datasheet

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0820-42

D0820-42

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

3,692 0.00

RFQ

D0820-42

Datasheet

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0822-01

D0822-01

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

3,852 0.00

RFQ

D0822-01

Datasheet

Bulk D0 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0822-42

D0822-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

2,182 0.00

RFQ

D0822-42

Datasheet

Bulk D0 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0824-01

D0824-01

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

3,356 0.00

RFQ

D0824-01

Datasheet

Bulk D0 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0824-42

D0824-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

2,232 0.00

RFQ

D0824-42

Datasheet

Bulk D0 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0828-42

D0828-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

3,093 0.00

RFQ

D0828-42

Datasheet

Bulk D0 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
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