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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
D01-9973242 CONN SOCKET SIP 32POS GOLD Harwin Inc.	14,048	3.49	RFQ	PDF	Tube	D01-997	Active	SIP	32 (1 x 32)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9953242 CONN SOCKET SIP 32POS GOLD Harwin Inc.	3,183	7.45	RFQ	PDF	Bulk	D01-995	Active	SIP	32 (1 x 32)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9972042 CONN SOCKET SIP 20POS GOLD Harwin Inc.	5,816	1.83	RFQ	PDF	Tube	D01-997	Active	SIP	20 (1 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D2899-42 CONN IC DIP SOCKET 3POS GOLD Harwin Inc.	1,566	1.88	RFQ	PDF	Bulk	D2	Active	DIP, 0.3 (7.62mm) Row Spacing	3 (1 x 3), 2 Loaded	0.200 (5.08mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.200 (5.08mm)	Tin	196.9µin (5.00µm)	Brass	Polyamide (PA), Nylon, Glass Filled
D2840-42 CONN IC DIP SOCKET 40POS GOLD Harwin Inc.	255	4.60	RFQ	PDF	Tube	D2	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic
D01-9952042 CONN SOCKET SIP 20POS GOLD Harwin Inc.	364	5.74	RFQ	PDF	Bulk	D01-995	Active	SIP	20 (1 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D2822-42 CONN IC DIP SOCKET 22POS GOLD Harwin Inc.	1,083	2.64	RFQ	PDF	Tube	D2	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic
D2824-42 CONN IC DIP SOCKET 24POS GOLD Harwin Inc.	2,780	2.66	RFQ	PDF	Tube	D2	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic
D2928-42 CONN IC DIP SOCKET 28POS GOLD Harwin Inc.	165	3.11	RFQ	PDF	Tube	D2	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic
D2832-42 CONN IC DIP SOCKET 32POS GOLD Harwin Inc.	405	3.55	RFQ	PDF	Tube	D2	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic
D2818-42 CONN IC DIP SOCKET 18POS GOLD Harwin Inc.	2,060	2.16	RFQ	PDF	Tube	D2	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic
D01-9970442 CONN SOCKET SIP 4POS GOLD Harwin Inc.	3,370	0.62	RFQ	PDF	Tube	D01-997	Active	SIP	4 (1 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9970542 CONN SOCKET SIP 5POS GOLD Harwin Inc.	2,498	0.67	RFQ	PDF	Tube	D01-997	Active	SIP	5 (1 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9970742 CONN SOCKET SIP 7POS GOLD Harwin Inc.	4,797	0.98	RFQ	PDF	Tube	D01-997	Active	SIP	7 (1 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9971242 CONN SOCKET SIP 12POS GOLD Harwin Inc.	4,700	1.08	RFQ	PDF	Tube	D01-997	Active	SIP	12 (1 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D8864-42 CONN IC DIP SOCKET 64POS GOLD Harwin Inc.	432	10.34	RFQ	PDF	Tube	D8864	Active	DIP, 0.75 (19.05mm) Row Spacing	64 (2 x 32)	0.070 (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0808-42 CONN IC DIP SOCKET 8POS GOLD Harwin Inc.	159	2.05	RFQ	PDF	Bulk	D0	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D2924-42 CONN IC DIP SOCKET 24POS GOLD Harwin Inc.	2,150	3.50	RFQ	PDF	Tube	D2	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic
D0816-42 CONN IC DIP SOCKET 16POS GOLD Harwin Inc.	2,725	3.80	RFQ	PDF	Bulk	D0	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9970642 CONN SOCKET SIP 6POS GOLD Harwin Inc.	3,681	0.84	RFQ	PDF	Tube	D01-997	Active	SIP	6 (1 x 6)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled