Product Details

Wakefield-Vette 303M

Part No. 303M
Manufacturer Wakefield-Vette
Package Stud Mounted Semiconductor Cases
Datasheet 303M.pdf
Description HEATSINK COMPACT
RFQ

303M Details

Packaging Bulk
Series 303
ProductStatus Active
Type Board Level, Vertical
PackageCooled Press Fit
AttachmentMethod Rectangular, Fins
Shape 2.000 (50.80mm)
Length 3.000 (76.20mm)
Width -
Diameter 2.000 (50.80mm)
FinHeight 15.0W @ 37°C
PowerDissipation@TemperatureRise 1.30°C/W @ 250 LFM
ThermalResistance@ForcedAirFlow -
ThermalResistance@Natural Aluminum Alloy
Material
Datasheet 303M.pdf

1. How to find detailed information for 303M?

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2. How does E-BEST INDUSTRIAL (HK) CO.,LTD ensure product quality?

We work with qualified suppliers and follow strict supplier verification, component sourcing, and quality control procedures.

3. Are price and stock always accurate?

Electronic component stock changes frequently. Please submit RFQ or contact our sales team for the latest quotation and availability.

4. What payment methods are supported?

TT Bank Transfer, Wire Transfer, PayPal, Credit Card, Western Union and other common payment methods may be supported.

5. How is shipping arranged?

Customers can choose DHL, UPS, FedEx, TNT or other logistics methods depending on destination and order requirements.

6. How to contact us for technical support?

Please contact us by email: candy@ebest-hk.com.

303M Shopping process

Availability

3,689

In-stock availability for fast quotation and sourcing confirmation.

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Telephone
+86 13510572937
Email
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