Core Specification Parameters

1. Electrical Performance Parameters

• Operating Frequency Range: Dual-band coverage of 2.4GHz~2.5GHz (low band) and 5.15GHz~5.85GHz (high band), fully compatible with mainstream Wi-Fi communication bands;
• Gain: Typical gain of 2.0dBi for the low band and 2.2dBi for the high band, ensuring long-distance transmission and wall-penetrating performance;
• Impedance: Standard 50Ω characteristic impedance, matching most radio frequency (RF) circuit designs;
• Voltage Standing Wave Ratio (VSWR): ≤2.0 (full operating frequency band), effectively reducing signal reflection and improving energy transmission efficiency;
• Polarization: Linear polarization (horizontal/vertical optional, vertical polarization as default), adapting to signal coverage requirements of different scenarios;
• Radiation Pattern: Omnidirectional radiation with 360° signal coverage and no directional blind spots;
• Power Handling Capacity: Maximum input power of 1W (CW), meeting the power requirements of conventional wireless communication;
• Insertion Loss: ≤0.3dB (typical value), minimizing signal attenuation and ensuring transmission quality.

2. Physical and Mechanical Parameters

• Package Dimensions: 7.0mm×6.0mm×1.0mm (L×W×H), ultra-compact design saving PCB layout space;
• Package Type: Surface-mount ceramic package (SMT Ceramic Package) with a low-profile structure (height only 1.0mm), suitable for ultra-thin device designs;
• Mounting Method: Surface Mount Technology (SMT), compatible with reflow soldering processes (peak temperature ≤260℃, meeting lead-free soldering standards);
• Pin Configuration: 2 signal pins (input/output) + ground pin, with a pin pitch of 0.5mm for easy PCB routing;
• Weight: Approximately 0.03g, lightweight design without affecting the overall weight balance of the device;
• Housing Material: Ceramic substrate + metal radiator, combining mechanical strength and RF performance;
• Packaging Type: Tape and Reel packaging (TL01 is the packaging code), suitable for automated placement production lines to improve assembly efficiency.

3. Environmental and Reliability Parameters

• Operating Temperature Range: -40℃~+85℃ (industrial-grade wide temperature standard), adapting to harsh indoor and outdoor environments;
• Storage Temperature Range: -55℃~+125℃, ensuring stability during transportation and storage;
• Humidity Resistance: 5%~95% RH (non-condensing), strong moisture resistance;
• Vibration Resistance: Complies with IEC 60068-2-6 standard, excellent resistance to vibration and impact;
• Environmental Compliance: Lead-free (Pb-Free) design, complying with RoHS and REACH environmental standards, meeting global market access requirements.

Part Number Decoding

• ACM: Series prefix, identifying the product as part of the surface-mount ceramic antenna series;
• 7060: Package size code, corresponding to 7.0mm (length) × 6.0mm (width);
• 701: Version and frequency configuration code, where "7" represents dual-band support and "01" denotes a version optimized for specific frequency bands;
• 2PL: Pin and polarization code, with "2" indicating 2 signal pins and "PL" representing linear polarization;
• TL01: Packaging type code, specifying tape and reel packaging for automated production.

Core Product Features and Advantages

1. Dual-Band Compatibility and Multi-Protocol Support

2. Miniaturized and Low-Profile Design

3. High Reliability and Stability

4. Easy Integration and Low Cost

5. Excellent RF Performance

Typical Application Scenarios

1. Internet of Things (IoT) Devices

• Smart sensors (temperature and humidity sensors, smoke alarms, motion sensors);
• IoT gateways and data acquisition terminals;
• Security devices such as smart door locks, smart cameras, and smart doorbells.

2. Smart Home Products

• Smart speakers, smart light controllers, and smart curtain motors;
• Wireless control modules for smart home appliances such as air conditioners, refrigerators, and washing machines;
• Wireless communication nodes in home automation systems.

3. Consumer Electronic Devices

• Tablets, laptops, and portable routers;
• Wearable devices such as Bluetooth headsets, smart watches, and fitness trackers;
• Wireless networking modules for portable game devices and high-definition players.

4. Industrial Control and Medical Electronics

• Industrial Internet of Things (IIoT) devices and PLC wireless communication modules;
• Industrial sensor networks and wireless data transmission terminals;
• Wireless data upload modules for portable medical monitors and remote diagnosis equipment.