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Sockets for ICs, Transistors(21991)
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1-1747890-2CONN SOCKET LGA 771POS GOLD |
2,034 | 0.00 |
|
Tray | - | Obsolete | LGA | 771 (33 x 33) | 0.043 (1.09mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic | |
|
|
1-2013620-3CONN SOCKET PGA ZIF 988POS GOLD |
3,980 | 0.00 |
|
- | Tape & Reel (TR) | - | Obsolete | PGA, ZIF (ZIP) | 988 (35 x 36) | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | Copper Alloy | Thermoplastic |
|
|
2013620-3CONN SOCKET PGA ZIF 989POS GOLD |
3,801 | 13.93 |
|
- | Tape & Reel (TR),Box | - | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | Copper Alloy | Thermoplastic |
|
|
2040540-2CONN SOCKET LGA 1156POS GOLD |
3,065 | 26.19 |
|
Tray,Box | - | Active | LGA | 1156 (34 x 34) | 0.036 (0.91mm) | Gold | Flash | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.039 (1.00mm) | - | - | Copper Alloy | Thermoplastic | |
|
|
516-AG11D-ESDIP SOCKET T/H 16POS |
2,265 | 0.00 |
|
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | |
|
1-390262-3CONN IC DIP SOCKET 32POS TIN |
2,836 | 0.23 |
|
Tape & Reel (TR),Cut Tape (CT),Box | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | - | |
|
|
1554116-2CONN SOCKET LGA 1356POS GOLD |
3,933 | 0.00 |
|
Tray | - | Obsolete | LGA | 1356 (32 x 41) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040 (1.01mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | |
|
|
1554116-3CONN SOCKET LGA 1356POS GOLD |
2,557 | 0.00 |
|
Tray | - | Obsolete | LGA | 1356 (32 x 41) | 0.040 (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040 (1.01mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | |
|
|
1939737-1CONN SOCKET LGA 1366POS |
2,987 | 0.00 |
|
- | Tray | - | Obsolete | LGA | 1366 (32 x 41) | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
2069965-1CONN SOCKET LGA 1155POS GOLD |
3,263 | 9.50 |
|
Bulk,Bulk | - | Active | LGA | 1155 (40 x 40) | 0.036 (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036 (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | |
|
|
506-AG11DCONN IC DIP SOCKET 6POS GOLD |
3,355 | 0.00 |
|
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | |
|
506-AG11D-ESCONN IC DIP SOCKET 6POS GOLD |
2,984 | 0.00 |
|
- | Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
5-1437530-2CONN IC SIP SOCKET 8POS GOLD |
2,855 | 0.00 |
|
Tube | 500 | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | - | Brass | Polyester | |
|
516-AG7DCONN IC DIP SOCKET 16POS GOLD |
3,326 | 0.00 |
|
- | Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | Polyester |
|
524-AG11D-ESCONN IC DIP SOCKET 24POS GOLD |
2,062 | 0.00 |
|
Bulk | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | |
|
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2069189-1CONN SOCKET LGA 1944POS GOLD |
2,331 | 0.00 |
|
Tray | - | Obsolete | LGA | 1944 (G34) | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | |
|
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2069189-2CONN SOCKET LGA 1944POS GOLD |
3,472 | 0.00 |
|
Tray | - | Obsolete | LGA | 1944 (G34) | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) | |
|
2-382189-2CONN IC DIP SOCKET 32POS GOLD |
2,366 | 0.00 |
|
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Thermoplastic | |
|
2-382468-4CONN IC DIP SOCKET 40POS GOLD |
3,412 | 0.00 |
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Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | Thermoplastic | |
|
2-641262-4CONN IC DIP SOCKET 16POS GOLD |
3,963 | 0.00 |
|
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
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