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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-641260-4CONN IC DIP SOCKET 8POS GOLD |
3,331 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641262-1CONN IC DIP SOCKET 16POS TIN |
3,469 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-640464-2CONN IC DIP SOCKET 20POS GOLD |
3,353 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641267-1CONN IC DIP SOCKET 28POS TIN |
2,356 | 0.76 |
RFQ |
Datasheet |
Tube,Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-640362-2CONN IC DIP SOCKET 28POS GOLD |
2,610 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-640358-2CONN IC DIP SOCKET 16POS GOLD |
2,928 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-640361-2CONN IC DIP SOCKET 24POS GOLD |
2,810 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic |
|
|
2-640379-2CONN IC DIP SOCKET 40POS GOLD |
3,268 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-640463-2CONN IC DIP SOCKET 8POS GOLD |
3,906 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641267-3CONN IC DIP SOCKET 28POS TIN |
3,730 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641615-1CONN IC DIP SOCKET 28POS TIN |
2,929 | 0.80 |
RFQ |
Datasheet |
Tube,Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641606-2CONN IC DIP SOCKET 40POS GOLD |
3,455 | 3.16 |
RFQ |
Datasheet |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641609-1CONN IC DIP SOCKET 14POS TIN |
2,490 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641610-1CONN IC DIP SOCKET 16POS TIN |
2,082 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | - |
|
2-641605-2CONN IC DIP SOCKET 28POS GOLD |
2,941 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641612-1CONN IC DIP SOCKET 20POS TIN |
2,460 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
2-641605-4CONN IC DIP SOCKET 28POS GOLD |
3,479 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641268-1CONN IC DIP SOCKET 40POS TIN |
2,011 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641296-2CONN IC DIP SOCKET 6POS GOLD |
3,620 | 0.36 |
RFQ |
Datasheet |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641599-2CONN IC DIP SOCKET 14POS GOLD |
2,069 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
