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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
SIP1X16-041BLF CONN SOCKET SIP 16POS GOLD Amphenol ICC (FCI)	3,937	0.00	RFQ	PDF	Bulk	SIP1x	Obsolete	SIP	16 (1 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
DPF316-998Z CONN IC DIP SOCKET 16POS TINLEAD Amphenol ICC (FCI)	2,766	0.00	RFQ	PDF	Bag	DPF3	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF314-998Z CONN IC DIP SOCKET 14POS TINLEAD Amphenol ICC (FCI)	2,020	0.00	RFQ	PDF	Bag	DPF3	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF308-998Z CONN IC DIP SOCKET 8POS TIN-LEAD Amphenol ICC (FCI)	3,799	0.00	RFQ	PDF	Bag	DPF3	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X02-041BLF CONN SOCKET SIP 2POS GOLD Amphenol ICC (FCI)	2,938	0.00	RFQ	PDF	Bulk	SIP1x	Obsolete	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
1-1747890-1 CONN SOCKET LGA 771POS GOLD TE Connectivity AMP Connectors	3,291	0.00	RFQ	PDF	Tray	-	Obsolete	LGA	771 (33 x 33)	0.043 (1.09mm)	Gold	-	Copper Alloy	Surface Mount	Open Frame	Solder	0.043 (1.09mm)	-	-	-	Thermoplastic
1735315-4 CONN SOCKET PGA ZIF 939POS GOLD TE Connectivity AMP Connectors	3,642	0.00	RFQ	PDF	Tray	-	Obsolete	PGA, ZIF (ZIP)	939 (31 x 31)	0.050 (1.27mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic
1871554-1 CONN SKT 1207-F RIGHT LEVER SMD TE Connectivity AMP Connectors	2,621	39.54	RFQ	PDF	Bulk	-	Obsolete	LGA	1207 (33 x 34)	0.043 (1.09mm)	Gold	-	Copper Alloy	Surface Mount	Closed Frame	Solder	0.043 (1.09mm)	Gold	-	Copper Alloy	Thermoplastic
1761503-1 CONN SOCKET PGA 940POS GOLD TE Connectivity AMP Connectors	2,337	0.00	RFQ	PDF	Tray	-	Active	PGA	940 (30 x 30)	0.050 (1.27mm)	Gold	30.0µin (0.76µm)	-	Surface Mount	Closed Frame	-	-	-	-	-	-
1-1903401-4 CONN SOCKET PGA 638POS GOLD TE Connectivity AMP Connectors	2,759	0.00	RFQ	PDF	Tape & Reel (TR),Cut Tape (CT)	-	Obsolete	PGA	638 (26 x 26)	0.050 (1.27mm)	Gold	Flash	Copper Alloy	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	-	Copper Alloy	Thermoplastic
1674770-6 CONN SOCKET PGA ZIF 479POS GOLD TE Connectivity AMP Connectors	2,783	0.00	RFQ	PDF	Tape & Reel (TR),Cut Tape (CT)	-	Obsolete	PGA, ZIF (ZIP)	479 (26 x 26)	0.050 (1.27mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic
8180-E1 CONN TRANSIST TO-3 4POS TIN Aavid, Thermal Division of Boyd Corporation	3,640	0.00	RFQ	PDF	Bulk	8180	Active	Transistor, TO-3	4 (Oval)	-	Tin	-	Steel	Through Hole	Closed Frame	Solder	-	Tin	-	Steel	Polyamide (PA), Nylon, Glass Filled
A28-LC-7-TT-R CONN IC DIP SOCKET 28POS TIN Assmann WSW Components	3,849	0.00	RFQ	PDF	Box	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)
MHAS-181-ZMGG-15 CONN SOCKET BGA 181POS GOLD Samtec Inc.	2,327	0.00	RFQ	PDF	Bulk	MHA	Obsolete	BGA	181 (15 x 15)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	-
100-006-050 CONN IC DIP SOCKET 6POS GOLD 3M	2,086	0.00	RFQ	PDF	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-008-050 CONN IC DIP SOCKET 8POS GOLD 3M	3,451	0.00	RFQ	PDF	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-008-051 CONN IC DIP SOCKET 8POS GOLD 3M	2,994	0.00	RFQ	PDF	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-010-050 CONN IC DIP SOCKET 10POS GOLD 3M	2,619	0.00	RFQ	PDF	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-014-050 CONN IC DIP SOCKET 14POS GOLD 3M	2,112	0.00	RFQ	PDF	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-014-051 CONN IC DIP SOCKET 14POS GOLD 3M	2,703	0.00	RFQ	PDF	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled