Upload BOM
Shipping address
Categories
Sockets for ICs, Transistors(21991)
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ED028PLCZCONN SOCKET PLCC 28POS TIN |
2,831 | 0.59 |
RFQ |
Datasheet |
Tube | ED | Active | PLCC | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
110-87-420-41-001101CONN IC DIP SOCKET 20POS GOLD |
2,820 | 0.56 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
410-87-214-10-001101CONN ZIG-ZAG 14POS GOLD |
3,607 | 0.57 |
RFQ |
Datasheet |
Bulk | 410 | Active | Zig-Zag | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
410-87-214-10-002101CONN ZIG-ZAG 14POS GOLD |
3,576 | 0.57 |
RFQ |
Datasheet |
Bulk | 410 | Active | Zig-Zag | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
612-83-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
3,058 | 0.58 |
RFQ |
Datasheet |
Bulk | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
2,564 | 0.56 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-87-314-41-117101CONN IC DIP SOCKET 14POS GOLD |
3,646 | 0.56 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-87-314-41-134161CONN IC DIP SOCKET 14POS GOLD |
2,537 | 0.56 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-83-610-41-001101CONN IC DIP SOCKET 10POS GOLD |
3,747 | 0.57 |
RFQ |
Bulk | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
114-83-210-41-117101CONN IC DIP SOCKET 10POS GOLD |
3,123 | 0.57 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-83-310-41-117101CONN IC DIP SOCKET 10POS GOLD |
2,373 | 0.59 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
114-83-310-41-134161CONN IC DIP SOCKET 10POS GOLD |
2,497 | 0.59 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
ED032PLCZCONN SOCKET PLCC 32POS TIN |
3,367 | 0.60 |
RFQ |
Datasheet |
Tube | ED | Active | PLCC | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
|
AW 127-39/Z-TSOCKET 39 CONTACTS SINGLE ROW |
3,345 | 0.61 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
4842-6000-CPCONN IC DIP SOCKET 42POS TIN |
2,623 | 0.61 |
RFQ |
Bulk | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin | 135.0µin (3.43µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 135.0µin (3.43µm) | Phosphor Bronze | Polyester, Glass Filled | |
|
ED052PLCZ-SM-NCONN SOCKET PLCC 52POS |
3,082 | 0.61 |
RFQ |
Datasheet |
Tube | ED | Active | PLCC | 52 (2 x 26) | 0.050 (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
122-87-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
3,538 | 0.63 |
RFQ |
Datasheet |
Bulk | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
123-87-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
2,445 | 0.63 |
RFQ |
Datasheet |
Bulk | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-83-308-41-105101CONN IC DIP SOCKET 8POS GOLD |
3,610 | 0.57 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-310-41-018101CONN IC DIP SOCKET 10POS GOLD |
2,714 | 0.57 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
