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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
48-6575-16 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	3,175	60.53	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6556-40 CONN IC DIP SOCKET 44POS GOLD Aries Electronics	2,004	60.87	RFQ	PDF	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
40-6556-41 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,497	60.92	RFQ	PDF	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
558-10-500M30-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	2,473	58.48	RFQ	PDF	Bulk	558	Active	PGA	500 (30 x 30)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-504M29-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	2,874	58.95	RFQ	PDF	Bulk	558	Active	PGA	504 (29 x 29)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-478M26-131104 BGA SURFACE MOUNT 1.27MM Preci-Dip	2,948	59.38	RFQ	PDF	Bulk	558	Active	BGA	478 (26 x 26)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-478M26-131105 CONN SOCKET PGA 478POS GOLD Preci-Dip	2,122	58.27	RFQ	PDF	Bulk	518	Active	PGA	478 (26 x 26)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
558-10-480M29-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	3,762	59.62	RFQ	PDF	Bulk	558	Active	BGA	480 (29 x 29)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-480M29-001105 CONN SOCKET PGA 480POS GOLD Preci-Dip	2,447	59.86	RFQ	PDF	Bulk	518	Active	PGA	480 (29 x 29)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
48-6556-40 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2,949	62.52	RFQ	PDF	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
510-13-273-21-125001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,405	62.69	RFQ	PDF	Bulk	510	Active	PGA	273 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-273-21-125002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,177	62.69	RFQ	PDF	Bulk	510	Active	PGA	273 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-273-21-125003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,670	62.69	RFQ	PDF	Bulk	510	Active	PGA	273 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
192-PGM17043-10H CONN SOCKET PGA GOLD Aries Electronics	2,817	63.09	RFQ	PDF	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
42-6556-41 CONN IC DIP SOCKET 42POS GOLD Aries Electronics	2,077	63.17	RFQ	PDF	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
518-77-478M26-131106 CONN SOCKET PGA 478POS GOLD Preci-Dip	3,932	60.73	RFQ	PDF	Bulk	518	Active	PGA	478 (26 x 26)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
558-10-520M31-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	3,430	60.82	RFQ	PDF	Bulk	558	Active	PGA	520 (31 x 31)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-480M29-001106 CONN SOCKET PGA 480POS GOLD Preci-Dip	3,353	60.98	RFQ	PDF	Bulk	518	Active	PGA	480 (29 x 29)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
100-PRS10001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,475	63.77	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
514-83-560M33-001148 CONN SOCKET BGA 560POS GOLD Preci-Dip	2,318	61.41	RFQ	PDF	Bulk	514	Active	BGA	560 (33 x 33)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled