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Sockets for ICs, Transistors(21991)
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-41-114-13-061001SKT PGA SOLDRTL |
2,644 | 26.97 |
|
Bulk | 510 | Active | PGA | 114 (13 x 13) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-41-114-13-062001SKT PGA SOLDRTL |
2,369 | 26.97 |
|
Bulk | 510 | Active | PGA | 114 (13 x 13) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
614-87-238-19-101112CONN SOCKET PGA 238POS GOLD |
3,911 | 25.20 |
|
Bulk | 614 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
510-93-076-11-041001SOCKET SOLDERTAIL 76-PGA |
2,450 | 27.01 |
|
- | Bulk | 510 | Active | PGA | 76 (11 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-076-11-041002SKT PGA SOLDRTL |
2,517 | 27.01 |
|
Bulk | 510 | Active | PGA | 76 (11 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-93-076-11-041003SKT PGA SOLDRTL |
3,235 | 27.01 |
|
Bulk | 510 | Active | PGA | 76 (11 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
117-43-664-61-005000CONN IC SKT DBL |
2,622 | 27.01 |
|
- | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
117-43-764-61-005000CONN IC SKT DBL |
3,408 | 27.01 |
|
- | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
117-93-664-61-005000CONN IC SKT DBL |
3,172 | 27.01 |
|
- | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
117-93-764-61-005000CONN IC SKT DBL |
3,638 | 27.01 |
|
- | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
122-13-964-41-001000CONN IC DIP SOCKET 64POS GOLD |
2,674 | 27.07 |
|
Tube | 122 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-13-052-09-045001SKT PGA SOLDRTL |
2,455 | 27.07 |
|
Bulk | 510 | Active | PGA | 52 (9 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-13-052-09-045002SKT PGA SOLDRTL |
2,253 | 27.07 |
|
Bulk | 510 | Active | PGA | 52 (9 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-13-052-09-045003SKT PGA SOLDRTL |
3,901 | 27.07 |
|
Bulk | 510 | Active | PGA | 52 (9 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
111-43-964-61-001000CONN IC SKT DBL |
2,744 | 27.07 |
|
- | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
111-93-964-61-001000CONN IC SKT DBL |
2,016 | 27.07 |
|
- | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
28-6508-212CONN IC DIP SOCKET 28POS GOLD |
3,850 | 27.08 |
|
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
|
|
28-6508-312CONN IC DIP SOCKET 28POS GOLD |
3,200 | 27.08 |
|
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
|
|
510-43-088-13-062001SKT PGA SOLDRTL |
2,449 | 27.09 |
|
Bulk | 510 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-43-088-13-081001SKT PGA SOLDRTL |
2,647 | 27.09 |
|
Bulk | 510 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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