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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
117-43-668-41-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,245	21.56	RFQ	PDF	Tube	117	Active	DIP, 0.6 (15.24mm) Row Spacing	68 (2 x 34)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.070 (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,803	21.56	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-91-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,282	21.56	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-43-322-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,999	21.57	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-43-422-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,149	21.57	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
42-6571-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2,750	22.05	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-6572-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	3,301	22.05	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-6573-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2,257	22.05	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-6574-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	3,379	22.05	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-6575-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2,126	22.05	RFQ	PDF	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
517-87-545-17-000111 CONN SOCKET PGA 545POS GOLD Preci-Dip	2,491	21.07	RFQ	PDF	Bulk	517	Active	PGA	545 (17 x 17)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
127-93-764-41-002000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	2,079	22.27	RFQ	PDF	Tube	127	Active	DIP, 0.75 (19.05mm) Row Spacing	64 (2 x 32)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070 (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-764-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,920	22.27	RFQ	PDF	Tube	127	Active	DIP, 0.75 (19.05mm) Row Spacing	64 (2 x 32)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070 (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-632-61-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,364	22.27	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-93-632-61-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,061	22.27	RFQ	-	Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
42-3553-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2,213	20.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-6551-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	3,883	20.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-6552-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2,776	20.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-6553-10 CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics	2,232	20.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-3554-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2,829	20.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled