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Sockets for ICs, Transistors(21991)
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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346-93-125-41-013000CONN SOCKET SIP 25POS GOLD |
2,602 | 4.97 |
|
Bulk | 346 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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346-43-125-41-013000CONN SOCKET SIP 25POS GOLD |
3,766 | 4.97 |
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Bulk | 346 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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115-93-648-41-003000CONN IC DIP SOCKET 48POS GOLD |
3,024 | 4.97 |
|
Tube | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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714-43-117-31-018000CONN SOCKET SIP 17POS GOLD |
2,705 | 4.99 |
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Bulk | 714 | Active | SIP | 17 (1 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
117-93-640-41-005000CONN IC DIP SOCKET 40POS GOLD |
2,586 | 5.08 |
|
Tube | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
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117-43-640-41-005000CONN IC DIP SOCKET 40POS GOLD |
3,677 | 5.08 |
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Tube | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
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346-93-126-41-013000CONN SOCKET SIP 26POS GOLD |
3,652 | 5.17 |
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Bulk | 346 | Active | SIP | 26 (1 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
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346-43-126-41-013000CONN SOCKET SIP 26POS GOLD |
3,477 | 5.17 |
|
Bulk | 346 | Active | SIP | 26 (1 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
714-43-216-31-018000CONN IC DIP SOCKET 16POS GOLD |
2,429 | 5.18 |
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Bulk | 714 | Active | DIP, 0.1 (2.54mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
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714-43-118-31-018000CONN SOCKET SIP 18POS GOLD |
2,433 | 5.29 |
|
Bulk | 714 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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110-43-624-41-801000CONN IC DIP SOCKET 24POS GOLD |
2,985 | 5.31 |
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Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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123-43-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
3,336 | 5.36 |
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Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
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346-93-127-41-013000CONN SOCKET SIP 27POS GOLD |
2,682 | 5.37 |
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Bulk | 346 | Active | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
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346-43-127-41-013000CONN SOCKET SIP 27POS GOLD |
2,923 | 5.37 |
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Bulk | 346 | Active | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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123-13-320-41-001000CONN IC DIP SOCKET 20POS GOLD |
3,728 | 5.48 |
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Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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614-43-632-31-012000CONN IC DIP SOCKET 32POS GOLD |
2,751 | 5.49 |
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Tube | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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299-43-316-10-001000CONN IC DIP SOCKET 16POS GOLD |
3,702 | 5.52 |
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Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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346-93-128-41-013000CONN SOCKET SIP 28POS GOLD |
2,497 | 5.57 |
|
Bulk | 346 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
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346-43-128-41-013000CONN SOCKET SIP 28POS GOLD |
3,345 | 5.57 |
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Bulk | 346 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
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714-43-119-31-018000CONN SOCKET SIP 19POS GOLD |
2,358 | 5.58 |
|
Bulk | 714 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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