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Sockets for ICs, Transistors(21991)
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
714-43-106-31-018000CONN SOCKET SIP 6POS GOLD |
505 | 1.90 |
|
Bulk | 714 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
ICF-308-T-O-TRCONN IC DIP SOCKET 8POS TIN |
187 | 1.91 |
|
Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | |
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|
346-93-109-41-013000CONN SOCKET SIP 9POS GOLD |
241 | 1.93 |
|
Bulk | 346 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
1571552-6CONN IC DIP SOCKET 20POS TIN |
573 | 2.12 |
|
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
BU080Z-178-HTCONN IC DIP SOCKET 8POS GOLD |
3,091 | 2.15 |
|
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | |
|
110-43-316-10-005000CONN IC DIP SOCKET 16POS GOLD |
285 | 2.17 |
|
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8), 8 Loaded | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
110-93-424-41-001000CONN IC DIP SOCKET 24POS GOLD |
142 | 2.47 |
|
Tube | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
714-43-108-31-018000CONN SOCKET SIP 8POS GOLD |
536 | 2.54 |
|
Tube | 714 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
820-AG11D-ESL-LFCONN IC DIP SOCKET 20POS GOLD |
298 | 2.62 |
|
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
ICF-316-T-O-TRCONN IC DIP SOCKET 16POS TIN |
3,225 | 2.83 |
|
Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | |
|
110-43-328-10-001000CONN IC DIP SOCKET 28POS GOLD |
233 | 2.85 |
|
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14), 16 Loaded | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
346-93-116-41-013000CONN SOCKET SIP 16POS GOLD |
130 | 3.18 |
|
Bulk | 346 | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
115-43-424-41-003000CONN IC DIP SOCKET 24POS GOLD |
488 | 3.64 |
|
Tube | 115 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
117-43-316-41-005000CONN IC DIP SOCKET 16POS GOLD |
194 | 3.85 |
|
Tube | 117 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
115-43-648-41-003000CONN IC DIP SOCKET 48POS GOLD |
3,426 | 6.21 |
|
Tube | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
299-93-316-11-001000CONN IC DIP SOCKET 16POS GOLD |
2,416 | 6.50 |
|
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
110-13-318-41-801000CONN IC DIP SOCKET 18POS GOLD |
3,756 | 6.61 |
|
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
123-43-316-41-801000CONN IC DIP SOCKET 16POS GOLD |
3,422 | 6.61 |
|
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
299-43-616-10-002000CONN IC DIP SOCKET 16POS GOLD |
3,913 | 8.09 |
|
Tube | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
614-43-640-31-012000CONN IC DIP SOCKET 40POS GOLD |
2,747 | 8.26 |
|
Tube | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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