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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
02-0518-11

02-0518-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,829 0.45

RFQ

02-0518-11

Datasheet

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-11

02-1518-11

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2,910 0.45

RFQ

02-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0513-10T

06-0513-10T

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,553 0.91

RFQ

06-0513-10T

Datasheet

Bulk 0513 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0503-21

01-0503-21

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,913 0.91

RFQ

01-0503-21

Datasheet

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
01-0503-31

01-0503-31

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,908 0.91

RFQ

01-0503-31

Datasheet

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Gold 30.0µin (0.76µm) Brass Polyamide (PA), Nylon, Glass Filled
03-0518-11H

03-0518-11H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,351 0.96

RFQ

03-0518-11H

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-10H

07-0518-10H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,775 0.98

RFQ

07-0518-10H

Datasheet

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0508-21

01-0508-21

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,821 0.98

RFQ

01-0508-21

Datasheet

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
01-0508-31

01-0508-31

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,783 0.98

RFQ

01-0508-31

Datasheet

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
03-0518-10T

03-0518-10T

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,333 0.53

RFQ

03-0518-10T

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0517-90C

01-0517-90C

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,962 0.53

RFQ

01-0517-90C

Datasheet

Bulk 0517 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0513-10H

02-0513-10H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,301 0.56

RFQ

02-0513-10H

Datasheet

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-10

04-0518-10

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2,142 0.56

RFQ

04-0518-10

Datasheet

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-10

04-1518-10

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3,806 0.56

RFQ

04-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0513-10T

03-0513-10T

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,604 0.56

RFQ

03-0513-10T

Datasheet

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-10H

03-0518-10H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,604 0.56

RFQ

03-0518-10H

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0513-10

03-0513-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,905 0.58

RFQ

03-0513-10

Datasheet

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-11

03-0518-11

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,783 0.58

RFQ

03-0518-11

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-10T

04-0518-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,376 0.62

RFQ

04-0518-10T

Datasheet

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-10T

04-1518-10T

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3,239 0.62

RFQ

04-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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