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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
01-0518-11

01-0518-11

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,390 0.30

RFQ

01-0518-11

Datasheet

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-10

02-0518-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,429 0.34

RFQ

02-0518-10

Datasheet

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10

02-1518-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,252 0.34

RFQ

02-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-11

01-0513-11

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,850 0.38

RFQ

01-0513-11

Datasheet

Bulk 0513 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-00

02-1518-00

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,168 0.38

RFQ

02-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0513-10T

02-0513-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,297 0.40

RFQ

02-0513-10T

Datasheet

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-10H

02-0518-10H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,709 0.40

RFQ

02-0518-10H

Datasheet

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-10T

02-0518-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,654 0.40

RFQ

02-0518-10T

Datasheet

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10H

02-1518-10H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,145 0.40

RFQ

02-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10T

02-1518-10T

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,764 0.40

RFQ

02-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-10H

01-0513-10H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,468 0.42

RFQ

01-0513-10H

Datasheet

Bulk 0513 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0513-10

02-0513-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,984 0.42

RFQ

02-0513-10

Datasheet

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0513-10H

03-0513-10H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,766 0.78

RFQ

03-0513-10H

Datasheet

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-10

03-0518-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,632 0.45

RFQ

03-0518-10

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-2513-10

02-2513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,025 0.45

RFQ

02-2513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-3513-10

02-3513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,229 0.45

RFQ

02-3513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-4513-10

02-4513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,068 0.45

RFQ

02-4513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-11H

01-0513-11H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,656 0.45

RFQ

01-0513-11H

Datasheet

Bulk 0513 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-00

03-0518-00

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,076 0.45

RFQ

03-0518-00

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-11H

01-0518-11H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,411 0.45

RFQ

01-0518-11H

Datasheet

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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