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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
04-7482-10

04-7482-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,805 6.18

RFQ

04-7482-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7500-10

04-7500-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,129 6.18

RFQ

04-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7533-10

04-7533-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,229 6.18

RFQ

04-7533-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7545-10

04-7545-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,759 6.18

RFQ

04-7545-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7550-10

04-7550-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,108 6.18

RFQ

04-7550-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7560-10

04-7560-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,261 6.18

RFQ

04-7560-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7700-10

04-7700-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,982 6.18

RFQ

04-7700-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7755-10

04-7755-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,126 6.18

RFQ

04-7755-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7800-10

04-7800-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,684 6.18

RFQ

04-7800-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7850-10

04-7850-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,041 6.18

RFQ

04-7850-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7950-10

04-7950-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,153 6.18

RFQ

04-7950-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-3503-30

10-3503-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,097 6.11

RFQ

10-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-0511-10

06-0511-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

2,333 6.23

RFQ

06-0511-10

Datasheet

Bulk 511 Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9513-10T

30-9513-10T

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,871 6.23

RFQ

30-9513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0513-11H

19-0513-11H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3,356 6.23

RFQ

19-0513-11H

Datasheet

Bulk 0513 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3513-10H

18-3513-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,186 6.27

RFQ

18-3513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6513-11

24-6513-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,397 6.27

RFQ

24-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6513-10H

14-6513-10H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,428 6.27

RFQ

14-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0517-90C

14-0517-90C

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2,950 6.27

RFQ

14-0517-90C

Datasheet

Bulk 0517 Active SIP 14 (1 x 14) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0518-11H

21-0518-11H

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,479 6.30

RFQ

21-0518-11H

Datasheet

Bulk 518 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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