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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-8590-310C

06-8590-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,835 6.11

RFQ

06-8590-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-8950-310C

06-8950-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,979 6.11

RFQ

06-8950-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-10

40-6513-10

40 POS LOW PROF SOCK SERIES 513

Aries Electronics

3,388 6.11

RFQ

- 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-10H

24-6518-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,025 6.13

RFQ

24-6518-10H

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3501-20

16-3501-20

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2,155 6.13

RFQ

16-3501-20

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3501-30

16-3501-30

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2,703 6.13

RFQ

16-3501-30

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-101

24-6518-101

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,047 6.13

RFQ

24-6518-101

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
35-0518-11

35-0518-11

CONN SOCKET SIP 35POS GOLD

Aries Electronics

3,877 6.16

RFQ

35-0518-11

Datasheet

Bulk 518 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-102

18-3518-102

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,630 6.16

RFQ

18-3518-102

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-00

40-6513-00

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,521 6.16

RFQ

40-6513-00

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6518-11

32-6518-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,113 6.17

RFQ

32-6518-11

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-7350-10

04-7350-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,533 6.18

RFQ

04-7350-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7360-10

04-7360-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,327 6.18

RFQ

04-7360-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7375-10

04-7375-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,032 6.18

RFQ

04-7375-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7380-10

04-7380-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,183 6.18

RFQ

04-7380-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7400-10

04-7400-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,816 6.18

RFQ

04-7400-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7422-10

04-7422-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,531 6.18

RFQ

04-7422-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7425-10

04-7425-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,209 6.18

RFQ

04-7425-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7430-10

04-7430-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,452 6.18

RFQ

04-7430-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7445-10

04-7445-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,632 6.18

RFQ

04-7445-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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