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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-81250-210C

06-81250-210C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,577 0.00

RFQ

06-81250-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-81250-210C

08-81250-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,875 0.00

RFQ

08-81250-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8255-210C

08-8255-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,645 0.00

RFQ

08-8255-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8300-210C

08-8300-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,599 0.00

RFQ

08-8300-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8343-210C

08-8343-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,059 0.00

RFQ

08-8343-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8430-210C

08-8430-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,498 0.00

RFQ

08-8430-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8460-210C

08-8460-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,312 0.00

RFQ

08-8460-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8550-210C

08-8550-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,068 0.00

RFQ

08-8550-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8620-210C

08-8620-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,405 0.00

RFQ

08-8620-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-81000-210C

10-81000-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,819 0.00

RFQ

10-81000-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-81250-210C

10-81250-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,879 0.00

RFQ

10-81250-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8240-210C

10-8240-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,940 0.00

RFQ

10-8240-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8285-210C

10-8285-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,061 0.00

RFQ

10-8285-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8300-210C

10-8300-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,486 0.00

RFQ

10-8300-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8350-210C

10-8350-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,246 0.00

RFQ

10-8350-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8440-210C

10-8440-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,774 0.00

RFQ

10-8440-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8500-210C

10-8500-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,131 0.00

RFQ

10-8500-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8535-210C

10-8535-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,331 0.00

RFQ

10-8535-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8600-210C

10-8600-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,263 0.00

RFQ

10-8600-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8620-210C

10-8620-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,324 0.00

RFQ

10-8620-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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