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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-81250-10

14-81250-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,748 0.00

RFQ

14-81250-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8260-10

14-8260-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,643 0.00

RFQ

14-8260-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8350-10

14-8350-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,969 0.00

RFQ

14-8350-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8435-10

14-8435-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,917 0.00

RFQ

14-8435-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8470-10

14-8470-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,676 0.00

RFQ

14-8470-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8510-10

14-8510-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,631 0.00

RFQ

14-8510-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8620-10

14-8620-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,126 0.00

RFQ

14-8620-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8770-10

14-8770-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,739 0.00

RFQ

14-8770-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-81250-10

16-81250-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2,314 0.00

RFQ

16-81250-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-8430-10

16-8430-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3,355 0.00

RFQ

16-8430-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-8480-10

16-8480-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3,833 0.00

RFQ

16-8480-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-8700-10

16-8700-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3,098 0.00

RFQ

16-8700-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-8810-10

16-8810-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3,991 0.00

RFQ

16-8810-10

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-28440-10

10-28440-10

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

2,664 0.00

RFQ

10-28440-10

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-68500-10

18-68500-10

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3,343 0.00

RFQ

18-68500-10

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-68587-10

18-68587-10

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

2,727 0.00

RFQ

18-68587-10

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-68660-10

18-68660-10

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3,603 0.00

RFQ

18-68660-10

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-8255-211C

08-8255-211C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,836 0.00

RFQ

08-8255-211C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109002

1109002

SERIES 8XXX ELEVATOR SOCKET .200

Aries Electronics

2,369 0.00

RFQ

1109002

Datasheet

- - Active - - - - - - - - - - - - - -
2632-102-13

2632-102-13

SERIES 8XXX ELEVATOR SOCKET .200

Aries Electronics

2,337 0.00

RFQ

2632-102-13

Datasheet

- - Active - - - - - - - - - - - - - -
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