Categories

Sockets for ICs, Transistors(21991)

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-3574-18

32-3574-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,060 132.90
RFQ
PDF Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-6574-18

32-6574-18

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2,694 132.90
RFQ
PDF Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
240-PRS20014-12

240-PRS20014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,290 133.05
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
281-PRS19010-12

281-PRS19010-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,366 133.65
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
281-PLS19029-12

281-PLS19029-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,963 133.69
RFQ
PDF Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
281-PRS19029-12

281-PRS19029-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,713 133.69
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
256-PRS20005-12

256-PRS20005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,680 135.87
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
257-PLS20013-12

257-PLS20013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,259 136.04
RFQ
PDF Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
257-PRS20013-12

257-PRS20013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,254 136.04
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
257-PRS21011-12

257-PRS21011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,494 136.04
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
257-PRS21015-12

257-PRS21015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,709 136.04
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
257-PLS20012-12

257-PLS20012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,062 136.09
RFQ
PDF Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
257-PLS20018-12

257-PLS20018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,181 136.09
RFQ
PDF Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
257-PRS20012-12

257-PRS20012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,723 136.09
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
257-PRS20018-12

257-PRS20018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,069 136.09
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
324-PLS18001-12

324-PLS18001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,176 136.12
RFQ
PDF Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
324-PRS18001-12

324-PRS18001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,673 136.12
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
262-PLS20003-12

262-PLS20003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,838 136.84
RFQ
PDF Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
262-PRS20003-12

262-PRS20003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,171 136.84
RFQ
PDF Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
40-6551-18

40-6551-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3,341 140.30
RFQ
- Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
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