PLUS Member
Cart
All Categories
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
08-1518-00

08-1518-00

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,677 1.80

RFQ

08-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-10T

13-0518-10T

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,292 1.80

RFQ

13-0518-10T

Datasheet

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0513-10

11-0513-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2,861 1.91

RFQ

11-0513-10

Datasheet

Bulk 0513 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0518-11

10-0518-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3,959 1.84

RFQ

10-0518-11

Datasheet

Bulk 518 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-11

10-1518-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,240 1.84

RFQ

10-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0518-10

15-0518-10

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3,323 1.84

RFQ

15-0518-10

Datasheet

Bulk 518 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0517-90C

04-0517-90C

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,894 1.84

RFQ

04-0517-90C

Datasheet

Bulk 0517 Active SIP 4 (1 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0513-10T

12-0513-10T

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3,646 1.89

RFQ

12-0513-10T

Datasheet

Bulk 0513 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0503-21

02-0503-21

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,463 1.89

RFQ

02-0503-21

Datasheet

Bulk 0503 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
02-0503-31

02-0503-31

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,379 1.89

RFQ

02-0503-31

Datasheet

Bulk 0503 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
03-0503-20

03-0503-20

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,507 1.89

RFQ

03-0503-20

Datasheet

Bulk 0503 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
03-0503-30

03-0503-30

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,397 1.89

RFQ

03-0503-30

Datasheet

Bulk 0503 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
14-1518-10T

14-1518-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,462 1.89

RFQ

14-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3513-10T

14-3513-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,122 1.89

RFQ

14-3513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6513-10T

10-6513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,209 1.91

RFQ

10-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0518-11H

06-0518-11H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,834 1.91

RFQ

06-0518-11H

Datasheet

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-11H

06-1518-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,546 1.91

RFQ

06-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-10H

13-0518-10H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,225 1.91

RFQ

13-0518-10H

Datasheet

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0518-10T

14-0518-10T

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2,488 1.91

RFQ

14-0518-10T

Datasheet

Bulk 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3518-10H

08-3518-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,354 1.93

RFQ

08-3518-10H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Records«Prev1... 1112131415161718...217Next»
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER