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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
09-0513-10T

09-0513-10T

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3,181 1.51

RFQ

09-0513-10T

Datasheet

Bulk 0513 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-11

08-0518-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3,795 1.51

RFQ

08-0518-11

Datasheet

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-11

08-1518-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,433 1.51

RFQ

08-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0513-10H

06-0513-10H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,853 1.53

RFQ

06-0513-10H

Datasheet

Bulk 0513 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0518-10H

10-0518-10H

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3,589 1.53

RFQ

10-0518-10H

Datasheet

Bulk 518 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-10H

10-1518-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,386 1.53

RFQ

10-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0518-10

12-0518-10

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3,165 1.53

RFQ

12-0518-10

Datasheet

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-10

12-1518-10

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,667 1.53

RFQ

12-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-6513-10

02-6513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2,089 1.56

RFQ

02-6513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6513-10

06-6513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,937 1.56

RFQ

06-6513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-6513-10T

08-6513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,417 1.56

RFQ

08-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-00

07-0518-00

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3,273 1.56

RFQ

07-0518-00

Datasheet

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-10T

11-0518-10T

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,117 1.56

RFQ

11-0518-10T

Datasheet

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-10T

20-3518-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,313 1.58

RFQ

20-3518-10T

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0513-10

09-0513-10

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2,398 1.62

RFQ

09-0513-10

Datasheet

Bulk 0513 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0513-10T

10-0513-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3,129 1.62

RFQ

10-0513-10T

Datasheet

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0508-20

03-0508-20

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,454 1.62

RFQ

03-0508-20

Datasheet

Bulk 508 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
03-0508-30

03-0508-30

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,881 1.62

RFQ

03-0508-30

Datasheet

Bulk 508 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
05-0518-11H

05-0518-11H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,928 1.64

RFQ

05-0518-11H

Datasheet

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-10H

11-0518-10H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,853 1.64

RFQ

11-0518-10H

Datasheet

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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