Categories

Sockets for ICs, Transistors(21991)

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
27-7530-10

27-7530-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,675 17.80
RFQ
PDF Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7550-10

27-7550-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,199 17.80
RFQ
PDF Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7580-10

27-7580-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

2,967 17.80
RFQ
PDF Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7650-10

27-7650-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,238 17.80
RFQ
PDF Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-0511-11

16-0511-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,636 17.82
RFQ
PDF Bulk 511 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-01

40-6518-01

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,852 17.99
RFQ
PDF Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-3574-10

32-3574-10

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

2,197 18.00
RFQ
PDF Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-9513-11H

32-9513-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,555 18.01
RFQ
PDF Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-30

24-4508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,320 18.03
RFQ
PDF Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6518-10E

48-6518-10E

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,602 18.04
RFQ
PDF Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-526-11

24-526-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3,605 18.08
RFQ
PDF Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
120-PGM13015-10

120-PGM13015-10

CONN SOCKET PGA GOLD

Aries Electronics

2,401 18.09
RFQ
PDF Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0503-21

22-0503-21

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,118 18.11
RFQ
PDF Bulk 0503 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
22-0503-31

22-0503-31

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,111 18.11
RFQ
PDF Bulk 0503 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
37-PGM10012-11

37-PGM10012-11

CONN SOCKET PGA GOLD

Aries Electronics

2,198 18.11
RFQ
PDF Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0511-11

15-0511-11

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3,940 18.14
RFQ
PDF Bulk 511 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-211

16-3508-211

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,026 18.14
RFQ
PDF Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-311

16-3508-311

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,308 18.14
RFQ
PDF Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-7440-10

28-7440-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

3,607 18.16
RFQ
PDF Bulk 700 Elevator Strip-Line™ Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-7750-10

28-7750-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

2,832 18.16
RFQ
PDF Bulk 700 Elevator Strip-Line™ Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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