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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
110-41-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	1,368	0.91	RFQ	PDF	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
SA183040 CONN IC DIP SOCKET 18POS GOLD On Shore Technology Inc.	3,568	0.96	RFQ	PDF	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled
24-526-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	2,942	11.69	RFQ	PDF	Bulk	Lo-PRO®file, 526	Active	DIP, ZIF (ZIP)	24 (2 x 12)	0.100 (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled
110-99-318-41-001000 CONN IC DIP SOCKET 18POS TINLEAD Mill-Max Manufacturing Corp.	2,890	1.15	RFQ	PDF	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-820-90C CONN IC DIP SOCKET 20POS GOLD Aries Electronics	100	12.62	RFQ	PDF	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-6554-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	187	13.33	RFQ	PDF	Tube	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
ICF-640-S-O CONN IC DIP SOCKET 40POS TIN Samtec Inc.	794	13.91	RFQ	PDF	Tube	iCF	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)
110-99-320-41-001000 CONN IC DIP SOCKET 20POS TINLEAD Mill-Max Manufacturing Corp.	785	1.27	RFQ	PDF	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-6554-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	2,031	15.22	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
MPP-1100-05-DS-4GR(S1402) CONN TRANSIST TO-220/TO-247 5POS Sullins Connector Solutions	2,906	17.48	RFQ	PDF	Tray	-	Active	Transistor, TO-220 and TO-247	5 (Rectangular)	-	Gold	30.0µin (0.76µm)	Nickel Boron	Through Hole, Right Angle	-	Solder	-	Gold	30.0µin (0.76µm)	Nickel Boron	Polyphenylene Sulfide (PPS)
110-44-328-41-001000 CONN IC DIP SOCKET 28POS TIN Mill-Max Manufacturing Corp.	3,748	1.66	RFQ	PDF	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-328-41-001000 CONN IC DIP SOCKET 28POS TINLEAD Mill-Max Manufacturing Corp.	2,068	1.66	RFQ	PDF	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
218-3341-00-0602J CONN IC DIP SOCKET ZIF 18POS GLD 3M	3,167	23.26	RFQ	PDF	Tray	Textool™	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
8080-1G7 CONN TRANSIST TO-3 4POS GOLD TE Connectivity AMP Connectors	2,839	23.40	RFQ	PDF	Bulk	8080	Active	Transistor, TO-3	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Fluoropolymer (FP)
SA486000 CONN IC DIP SOCKET 48POS GOLD On Shore Technology Inc.	3,315	2.10	RFQ	PDF	Tube	SA	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled
222-3343-00-0602J CONN IC DIP SOCKET ZIF 22POS GLD 3M	3,739	25.50	RFQ	PDF	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
228-1277-00-0602J CONN IC DIP SOCKET ZIF 28POS GLD 3M	3,711	25.69	RFQ	PDF	Bulk,Tube	Textool™	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
123-87-316-41-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	3,086	2.11	RFQ	PDF	Tube	123	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-3513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3,325	2.26	RFQ	PDF	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
224-1286-00-0602J CONN IC DIP SOCKET ZIF 24POS GLD 3M	2,483	29.94	RFQ	PDF	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled