Categories

Sockets for ICs, Transistors(21991)

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-43-308-41-117000

114-43-308-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,424 12.39
RFQ
PDF Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3503-20

24-3503-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,536 12.40
RFQ
PDF Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-3503-30

24-3503-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,407 12.40
RFQ
PDF Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-0503-20

22-0503-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,427 12.40
RFQ
PDF Bulk 0503 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
22-0503-30

22-0503-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,916 12.40
RFQ
PDF Bulk 0503 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
14-1508-21

14-1508-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,297 12.40
RFQ
PDF Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
14-1508-31

14-1508-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,737 12.40
RFQ
PDF Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
510-87-441-21-000101

510-87-441-21-000101

CONN SOCKET PGA 441POS GOLD

Preci-Dip

3,796 11.73
RFQ
PDF Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-120-13-061117

514-83-120-13-061117

CONN SOCKET PGA 120POS GOLD

Preci-Dip

2,770 11.74
RFQ
PDF Bulk 514 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-41-306-41-003000

116-41-306-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,461 12.41
RFQ
PDF Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-306-41-003000

116-91-306-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,994 12.41
RFQ
PDF Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-148-31-018000

714-43-148-31-018000

CONN SOCKET SIP 48POS GOLD

Mill-Max Manufacturing Corp.

2,588 12.41
RFQ
PDF Bulk 714 Active SIP 48 (1 x 48) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-41-103-41-001000

917-41-103-41-001000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

2,957 12.41
RFQ
PDF Tube 917 Active Transistor, TO-5 3 (Round) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-308-41-006000

116-41-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,024 12.42
RFQ
PDF Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-308-41-006000

116-91-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,245 12.42
RFQ
PDF Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
MS06

MS06

CONN SOCKET SIP 20POS GOLD

Apex Microtechnology

3,874 12.42
RFQ
PDF Bulk Apex Precision Power® Discontinued at Mosen SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyester, Glass Filled
22-4518-01

22-4518-01

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,156 12.42
RFQ
PDF Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-99-322-41-001000

110-99-322-41-001000

CONN IC DIP SOCKET 22POS TINLEAD

Mill-Max Manufacturing Corp.

2,042 12.42
RFQ
PDF Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-422-41-001000

110-99-422-41-001000

CONN IC DIP SOCKET 22POS TINLEAD

Mill-Max Manufacturing Corp.

3,743 12.42
RFQ
PDF Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-322-41-001000

110-44-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,591 12.42
RFQ
PDF Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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5,000+

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