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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-83-478M26-131148

514-83-478M26-131148

CONN SOCKET BGA 478POS GOLD

Preci-Dip

3,036 52.41

RFQ

514-83-478M26-131148

Datasheet

Bulk 514 Active BGA 478 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-600M35-001148

514-87-600M35-001148

CONN SOCKET BGA 600POS GOLD

Preci-Dip

3,064 52.58

RFQ

514-87-600M35-001148

Datasheet

Bulk 514 Active BGA 600 (35 x 35) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-480M29-001148

514-83-480M29-001148

CONN SOCKET BGA 480POS GOLD

Preci-Dip

2,690 52.63

RFQ

514-83-480M29-001148

Datasheet

Bulk 514 Active BGA 480 (29 x 29) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-478M26-131152

550-10-478M26-131152

BGA SOLDER TAIL

Preci-Dip

2,256 52.86

RFQ

550-10-478M26-131152

Datasheet

Bulk 550 Active BGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-480M29-001152

550-10-480M29-001152

BGA SOLDER TAIL

Preci-Dip

3,285 53.08

RFQ

550-10-480M29-001152

Datasheet

Bulk 550 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-456M26-001101

558-10-456M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2,546 53.34

RFQ

558-10-456M26-001101

Datasheet

Bulk 558 Active PGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-420M26-001106

518-77-420M26-001106

CONN SOCKET PGA 420POS GOLD

Preci-Dip

2,203 53.36

RFQ

518-77-420M26-001106

Datasheet

Bulk 518 Active PGA 420 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-432M31-001104

558-10-432M31-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2,280 53.66

RFQ

558-10-432M31-001104

Datasheet

Bulk 558 Active BGA 432 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-432M31-001105

518-77-432M31-001105

CONN SOCKET PGA 432POS GOLD

Preci-Dip

3,008 53.88

RFQ

518-77-432M31-001105

Datasheet

Bulk 518 Active PGA 432 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
546-83-528-21-121147

546-83-528-21-121147

CONN SOCKET PGA 528POS GOLD

Preci-Dip

2,747 54.45

RFQ

546-83-528-21-121147

Datasheet

Bulk 546 Active PGA 528 (21 x 21) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-529-21-121147

546-83-529-21-121147

CONN SOCKET PGA 529POS GOLD

Preci-Dip

2,709 54.55

RFQ

546-83-529-21-121147

Datasheet

Bulk 546 Active PGA 529 (21 x 21) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-545-17-000147

546-83-545-17-000147

CONN SOCKET PGA 545POS GOLD

Preci-Dip

3,303 54.56

RFQ

546-83-545-17-000147

Datasheet

Bulk 546 Active PGA 545 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-500M30-001148

514-83-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip

2,107 54.83

RFQ

514-83-500M30-001148

Datasheet

Bulk 514 Active BGA 500 (30 x 30) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-432M31-001106

518-77-432M31-001106

CONN SOCKET PGA 432POS GOLD

Preci-Dip

2,922 54.88

RFQ

518-77-432M31-001106

Datasheet

Bulk 518 Active PGA 432 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-83-504M29-001148

514-83-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip

2,726 55.27

RFQ

514-83-504M29-001148

Datasheet

Bulk 514 Active BGA 504 (29 x 29) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-500M30-001152

550-10-500M30-001152

BGA SOLDER TAIL

Preci-Dip

2,465 55.29

RFQ

550-10-500M30-001152

Datasheet

Bulk 550 Active BGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-504M29-001152

550-10-504M29-001152

BGA SOLDER TAIL

Preci-Dip

2,147 55.73

RFQ

550-10-504M29-001152

Datasheet

Bulk 550 Active BGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-478M26-131101

558-10-478M26-131101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,339 55.91

RFQ

558-10-478M26-131101

Datasheet

Bulk 558 Active PGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-480M29-001101

558-10-480M29-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,245 56.15

RFQ

558-10-480M29-001101

Datasheet

Bulk 558 Active PGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-456M26-001104

558-10-456M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3,258 56.64

RFQ

558-10-456M26-001104

Datasheet

Bulk 558 Active BGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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