PLUS Member
Cart
All Categories
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-10-381-18-101135

550-10-381-18-101135

PGA SOLDER TAIL

Preci-Dip

2,631 47.62

RFQ

550-10-381-18-101135

Datasheet

Bulk 550 Active PGA 381 (18 x 18) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-463-19-101147

546-83-463-19-101147

CONN SOCKET PGA 463POS GOLD

Preci-Dip

3,240 47.75

RFQ

546-83-463-19-101147

Datasheet

Bulk 546 Active PGA 463 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-432M31-001152

550-10-432M31-001152

BGA SOLDER TAIL

Preci-Dip

2,306 47.77

RFQ

550-10-432M31-001152

Datasheet

Bulk 550 Active BGA 432 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-388M26-001104

558-10-388M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2,007 48.20

RFQ

558-10-388M26-001104

Datasheet

Bulk 558 Active BGA 388 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-388M26-001105

518-77-388M26-001105

CONN SOCKET PGA 388POS GOLD

Preci-Dip

3,061 48.39

RFQ

518-77-388M26-001105

Datasheet

Bulk 518 Active PGA 388 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-87-560M33-001148

514-87-560M33-001148

CONN SOCKET BGA 560POS GOLD

Preci-Dip

3,256 49.07

RFQ

514-87-560M33-001148

Datasheet

Bulk 514 Active BGA 560 (33 x 33) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-420M26-001101

558-10-420M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,930 48.02

RFQ

558-10-420M26-001101

Datasheet

Bulk 558 Active PGA 420 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-388M26-001106

518-77-388M26-001106

CONN SOCKET PGA 388POS GOLD

Preci-Dip

2,860 49.29

RFQ

518-77-388M26-001106

Datasheet

Bulk 518 Active PGA 388 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-400M20-000104

558-10-400M20-000104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2,909 48.57

RFQ

558-10-400M20-000104

Datasheet

Bulk 558 Active BGA 400 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-400M20-000105

518-77-400M20-000105

CONN SOCKET PGA 400POS GOLD

Preci-Dip

2,052 48.76

RFQ

518-77-400M20-000105

Datasheet

Bulk 518 Active PGA 400 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-83-456M26-001148

514-83-456M26-001148

CONN SOCKET BGA 456POS GOLD

Preci-Dip

3,533 50.00

RFQ

514-83-456M26-001148

Datasheet

Bulk 514 Active BGA 456 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-456M26-001152

550-10-456M26-001152

BGA SOLDER TAIL

Preci-Dip

2,265 50.42

RFQ

550-10-456M26-001152

Datasheet

Bulk 550 Active BGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-576M30-001148

514-87-576M30-001148

CONN SOCKET BGA 576POS GOLD

Preci-Dip

2,657 50.47

RFQ

514-87-576M30-001148

Datasheet

Bulk 514 Active BGA 576 (30 x 30) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-432M31-001101

558-10-432M31-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2,487 50.53

RFQ

558-10-432M31-001101

Datasheet

Bulk 558 Active PGA 432 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-400M20-000106

518-77-400M20-000106

CONN SOCKET PGA 400POS GOLD

Preci-Dip

2,193 49.67

RFQ

518-77-400M20-000106

Datasheet

Bulk 518 Active PGA 400 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
550-10-652M35-001166

550-10-652M35-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

2,170 51.74

RFQ

550-10-652M35-001166

Datasheet

Bulk 550 Active BGA 652 (35 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-503-22-131147

546-83-503-22-131147

CONN SOCKET PGA 503POS GOLD

Preci-Dip

3,708 51.87

RFQ

546-83-503-22-131147

Datasheet

Bulk 546 Active PGA 503 (22 x 22) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-296-19-131147

546-83-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip

2,029 52.13

RFQ

546-83-296-19-131147

Datasheet

Bulk 546 Active PGA 296 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-420M26-001104

558-10-420M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3,020 52.17

RFQ

558-10-420M26-001104

Datasheet

Bulk 558 Active BGA 420 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-420M26-001105

518-77-420M26-001105

CONN SOCKET PGA 420POS GOLD

Preci-Dip

3,126 52.38

RFQ

518-77-420M26-001105

Datasheet

Bulk 518 Active PGA 420 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
Total 2821 Records«Prev1... 133134135136137138139140...142Next»
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER