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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR40-HZL-TTCONN IC DIP SOCKET 40POS TIN |
3,111 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR48-HZL-TTCONN IC DIP SOCKET 48POS TIN |
3,173 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR64-HZL-TTCONN IC DIP SOCKET 64POS TIN |
2,532 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR28-HZL/01-TTCONN IC DIP SOCKET 28POS GOLD |
3,721 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
AR28-HZL/7/01-TTCONN IC DIP SOCKET 28POS GOLD |
3,539 | 0.00 |
RFQ |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | |
|
AR32-HZL/01-TTCONN IC DIP SOCKET 32POS GOLD |
2,532 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR40-HZL/01-TTCONN IC DIP SOCKET 40POS GOLD |
2,041 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
AW-127A-20-ZCONN SOCKET SIP 20POS TIN |
3,592 | 0.00 |
RFQ |
Datasheet |
- | - | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | 78.7µin (2.00µm) | - | Through Hole | Closed Frame | - | - | - | - | - | - |
|
|
AR06-HZL/01-TTCONN IC DIP SOCKET 6POS GOLD |
2,629 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR08-HZL/01-TTCONN IC DIP SOCKET 8POS GOLD |
3,320 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR14-HZL/01-TTCONN IC DIP SOCKET 14POS GOLD |
2,716 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR16-HZL/01-TTCONN IC DIP SOCKET 16POS GOLD |
3,617 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR20-HZL/01-TTCONN IC DIP SOCKET 20POS GOLD |
3,937 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR24-HZL/01-TTCONN IC DIP SOCKET 24POS GOLD |
2,835 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR24-HZL/7/01-TTCONN IC DIP SOCKET 24POS GOLD |
2,365 | 0.00 |
RFQ |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | |
|
AR48-HZL/01-TTCONN IC DIP SOCKET 48POS GOLD |
3,318 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
AR06-HZL/07-TTCONN IC DIP SOCKET 6POS GOLD |
3,497 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR08-HZL/07-TTCONN IC DIP SOCKET 8POS GOLD |
3,529 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR14-HZL/07-TTCONN IC DIP SOCKET 14POS GOLD |
3,156 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR16-HZL/07-TTCONN IC DIP SOCKET 16POS GOLD |
3,191 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
