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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
232-2601-00-0602 CONN SOCKET SIP ZIF 32POS GOLD 3M	3,913	53.62	RFQ	PDF	Bulk	Textool™	Active	SIP, ZIF (ZIP)	32 (1 x 32)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
240-5205-00 CONN SOCKET QFN 40POS GOLD 3M	2,877	91.41	RFQ	PDF	Bulk	Textool™	Active	QFN	40 (4 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)
216-5205-01 CONN SOCKET QFN 16POS GOLD 3M	3,165	94.85	RFQ	PDF	Bulk	Textool™	Active	QFN	16 (3x3)	0.020 (0.50mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)
248-4205-01 CONN SOCKET QFN 48POS GOLD 3M	2,386	131.86	RFQ	PDF	Bulk	Textool™	Active	QFN	48 (4 x 12)	0.016 (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)
260-4204-01 CONN SOCKET QFN 60POS GOLD 3M	3,863	143.86	RFQ	PDF	Bulk	Textool™	Active	QFN	60 (4 x 15)	0.016 (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.016 (0.40mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)
200-6311-9UN-1900 CONN SOCKET PGA ZIF 121POS GOLD 3M	2,863	53.86	RFQ	PDF	Bulk	Textool™	Obsolete	PGA, ZIF (ZIP)	121 (11 x 11)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)
200-6317-9UN-1900 CONN SOCKET PGA ZIF 289POS GOLD 3M	3,844	73.36	RFQ	PDF	Bulk	Textool™	Obsolete	PGA, ZIF (ZIP)	289 (17 x 17)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)
235-3019-01-0602 CONN ZIG-ZAG ZIF 35POS GOLD 3M	2,262	93.01	RFQ	PDF	Bulk	Textool™	Active	Zig-Zag, ZIF (ZIP)	35 (1 x 17, 1 x 18)	0.050 (1.27mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
240-1280-00-0602J CONN IC DIP SOCKET ZIF 40POS GLD 3M	3,795	29.00	RFQ	PDF	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
288-4205-01 CONN SOCKET QFN 88POS GOLD 3M	3,446	171.67	RFQ	PDF	Bulk	Textool™	Active	QFN	88 (4 x 22)	0.016 (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.016 (0.40mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)
4840-6004-CP CONN IC DIP SOCKET 40POS TIN 3M	2,691	1.18	RFQ	PDF	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
214-7390-55-1902 CONN SOCKET SOIC 14POS GOLD 3M	3,941	34.27	RFQ	PDF	Bulk	Textool™	Active	SOIC	14 (2 x 7)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled
216-7383-55-1902 CONN SOCKET SOIC 16POS GOLD 3M	3,884	37.47	RFQ	PDF	Bulk	Textool™	Active	SOIC	16 (2 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled
280-5205-01 CONN SOCKET QFN 80POS GOLD 3M	2,668	150.66	RFQ	PDF	Bulk	Textool™	Active	QFN	80 (4 x 20)	0.020 (0.50mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.020 (0.50mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)
232-1287-00-0602J CONN IC DIP SOCKET ZIF 32POS GLD 3M	2,451	39.22	RFQ	PDF	Bulk	Textool™	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
240-1288-00-0602J CONN IC DIP SOCKET ZIF 40POS GLD 3M	2,222	46.21	RFQ	PDF	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
242-1293-00-0602J CONN IC DIP SOCKET ZIF 42POS GLD 3M	2,128	34.52	RFQ	PDF	Bulk	Textool™	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
228-7474-55-1902 CONN SOCKET SOIC 28POS GOLD 3M	3,393	46.45	RFQ	PDF	Bulk	Textool™	Active	SOIC	28 (2 x 14)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled
236-6225-00-0602 CONN SOCKET SIP ZIF 36POS GOLD 3M	2,583	56.11	RFQ	PDF	Bulk	Textool™	Active	SIP, ZIF (ZIP)	36 (1 x 36)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
251-5949-02-0602 CONN ZIG-ZAG ZIF 51POS GOLD 3M	2,734	110.48	RFQ	PDF	Bulk	Textool™	Active	Zig-Zag, ZIF (ZIP)	51 (1 x 25, 1 x 26)	0.050 (1.27mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled