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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2A-1425CONN IC DIP SOCKET 14POS GOLD |
2,864 | 2.93 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2P1041CONN SOCKET SIP 10POS GOLD |
3,403 | 2.99 |
RFQ |
Datasheet |
Bulk | XR2 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-1625CONN IC DIP SOCKET 16POS GOLD |
2,034 | 1.62 |
RFQ |
Datasheet |
Bulk,Box | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2T-1621-NCONN IC DIP SOCKET 16POS GOLD |
2,550 | 3.35 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-2015CONN SOCKET SIP 20POS GOLD |
2,203 | 3.74 |
RFQ |
Datasheet |
Bulk | XR2 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2A-3211-NZCONN IC DIP SOCKET 32POS GOLD |
3,984 | 4.15 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-2811-NCONN IC DIP SOCKET 28POS GOLD |
3,998 | 4.28 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-2471-NIC CONNECTOR |
2,352 | 4.41 |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
XR2A-2401-NCONN IC DIP SOCKET 24POS GOLD |
3,966 | 4.51 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-2025CONN IC DIP SOCKET 20POS GOLD |
2,752 | 4.90 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A2201NCONN IC DIP SOCKET 22POS GOLD |
3,821 | 4.97 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2T-2021-NCONN IC DIP SOCKET 20POS GOLD |
3,559 | 1.90 |
RFQ |
Datasheet |
Bulk,Box | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-3211-NCONN IC DIP SOCKET 32POS GOLD |
2,626 | 1.92 |
RFQ |
Datasheet |
Bulk,Box | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-2801-NCONN IC DIP SOCKET 28POS GOLD |
3,817 | 5.19 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C3215CONN SOCKET SIP 32POS GOLD |
2,308 | 5.68 |
RFQ |
Datasheet |
Bulk | XR2 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-2002CONN SOCKET SIP 20POS GOLD |
3,485 | 6.02 |
RFQ |
Datasheet |
Bulk | XR2 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-4011-NCONN IC DIP SOCKET 40POS GOLD |
2,455 | 6.08 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A3221NCONN IC DIP SOCKET 32POS GOLD |
3,641 | 6.19 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2T2421NCONN IC DIP SOCKET 24POS GOLD |
2,597 | 6.72 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Threaded | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2T2401NCONN IC DIP SOCKET 24POS GOLD |
3,151 | 6.80 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Threaded | Open Frame | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
