Core Specification Parameters

1. Logic Resources & Embedded Memory

• Logic Elements (LEs): 6,272 (basic building blocks for combinational logic and sequential logic implementation)
• Embedded Memory Blocks (EMBs): 234 Kbits (distributed as 13 M9K blocks, each configurable as RAM, ROM, or FIFO)
• DSP Slices: 26 (18x18 multiplier accumulators, supporting digital signal processing tasks such as filtering and modulation)
• PLLs (Phase-Locked Loops): 2 (for clock synthesis, jitter reduction, and frequency multiplication/division)
• Global Clock Networks: 8 (ensuring low-skew clock distribution across the device)

2. I/O & Package Specifications

• Total I/O Pins: 142 (including general-purpose I/Os and dedicated interface pins)
• Differential I/O Standards: Supports LVDS, LVPECL, and HyperTransport™, with a maximum data rate of 1.25 Gbps
• Single-Ended I/O Standards: Compatible with LVTTL, LVCMOS (1.8V/2.5V/3.3V), SSTL, and HSTL
• Package Type: TQFP-144 (144-pin Thin Quad Flat Package), 10mm×10mm body size, 0.5mm pin pitch
• Mounting Method: Surface Mount Technology (SMT), compatible with lead-free reflow soldering (peak temperature ≤260℃)

3. Electrical & Environmental Parameters

• Supply Voltage: Core voltage (VCCINT) 1.2V; I/O voltage (VCCIO) 1.2V/1.5V/1.8V/2.5V/3.3V (configurable per bank)
• Maximum Operating Frequency: Up to 380 MHz (for combinational logic) and 250 MHz (for sequential logic)
• Operating Temperature Range: Commercial grade (0℃~+85℃); Industrial grade option available (-40℃~+125℃)
• Power Consumption: Typical static power 0.4W, dynamic power 1.2W (at 100 MHz logic operation)
• Configuration Voltage: 3.3V (JTAG configuration) or 1.8V/2.5V/3.3V (Flash-based configuration)

Key Features and Advantages

1. Optimized 65nm Low-Power Architecture

• Adopts TSMC's 65nm low-leakage process, reducing static power by 30% compared to previous generations (Cyclone III)
• Dynamic power scaling based on logic activity, ideal for battery-powered or power-constrained applications

2. Flexible Configuration Options

• Supports multiple configuration modes: JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP)
• Compatible with external configuration devices (e.g., EPCS series Flash) for non-volatile storage of bitstreams
• In-system reconfiguration (ISR) enables real-time updates of logic functions without power cycling

3. Rich Embedded Resources

• M9K EMBs support dual-port RAM, single-port RAM, ROM, and FIFO modes, with built-in error correction (ECC) for critical data storage
• 18x18 DSP slices support multiply-accumulate (MAC) operations, enabling efficient implementation of digital filters, motor control algorithms, and video processing
• Integrated PLLs provide precise clock management, with phase shifting and spread-spectrum clocking to reduce electromagnetic interference (EMI)

4. High-Speed Interface Support

• Dedicated hardware for high-speed serial interfaces: LVDS transceivers (up to 1.25 Gbps) for point-to-point communication
• Supports industry-standard I/Os: SPI, I2C, UART, CAN, Ethernet (with external PHY), and DDR2/DDR3 SDRAM controllers (via soft IP)
• Programmable I/O banks with independent voltage domains, enabling seamless integration with mixed-voltage peripherals

5. Robust Reliability & Compatibility

• Industrial-grade temperature option available for harsh environment operation
• Compliant with RoHS and REACH standards, lead-free and halogen-free design
• Compatible with Altera's Quartus Prime Design Software (including free Web Edition), supporting Verilog, VHDL, and SystemC design entry

Typical Application Scenarios

1. Industrial Control & Automation

• Programmable Logic Controllers (PLCs) and distributed control systems (DCS)
• Motor control (AC/DC servo drives, stepper motor controllers)
• Industrial Ethernet gateways (Profinet, Ethernet/IP, Modbus TCP)
• Sensor data acquisition and real-time processing

2. Consumer Electronics

• Smart TV mainboards (video decoding, HDMI interface control)
• Set-top boxes and streaming devices (protocol conversion, content protection)
• Gaming consoles (peripheral interface management, audio/video processing)
• Home automation controllers (multi-protocol communication, scene control)

3. Communication Equipment

• Low-power wireless base stations (baseband signal processing, channel coding)
• Network switches and routers (packet filtering, port expansion)
• IoT gateways (protocol conversion between Wi-Fi/Bluetooth and Ethernet)
• Satellite communication terminals (modulation/demodulation, data framing)

4. Automotive Electronics

• In-vehicle infotainment systems (audio/video routing, interface control)
• Advanced Driver Assistance Systems (ADAS) (sensor fusion, real-time decision-making)
• Vehicle networking modules (CAN FD/Ethernet gateway, data logging)

5. Medical & Test Equipment

• Portable medical monitors (signal conditioning, data analysis)
• Diagnostic imaging equipment (image processing, data transmission)
• Test and measurement instruments (signal generation, data acquisition)