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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
8059-2G1CONN TRANSIST TO-5 3POS GOLD |
2,297 | 11.04 |
RFQ |
Datasheet |
Bulk | 8059 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon |
|
836-AG11DCONN IC DIP SOCKET 36POS GOLD |
2,402 | 15.77 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
1-2324271-8LEFT SEGMEN LGA4189-5 SOCKET-P5 |
2,459 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-7RIGHT SEGMEN LGA4189-5 SOCKET-P5 |
3,944 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
2-2129710-8CONN SOCKET LGA 3647POS GOLD |
2,490 | 37.37 |
RFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
2-2822979-4CONN SOCKET LGA 3647POS GOLD |
2,410 | 65.76 |
RFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
1571552-2CONN IC DIP SOCKET 8POS TIN |
413 | 1.73 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1571586-2CONN IC DIP SOCKET 8POS TIN |
909 | 1.90 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1571552-6CONN IC DIP SOCKET 20POS TIN |
573 | 2.12 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
820-AG11D-ESL-LFCONN IC DIP SOCKET 20POS GOLD |
298 | 2.62 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
506-AG10DCONN IC DIP SOCKET 6POS GOLD |
2,953 | 8.73 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Brass | - |
|
848-AG10DCONN IC DIP SOCKET 48POS GOLD |
2,842 | 16.42 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Copper Alloy | Polyester |
|
8058-1G30CONN TRANSIST TO-5 4POS GOLD |
2,773 | 19.49 |
RFQ |
Datasheet |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) |
|
2201838-2CONN SOCKET LGA 2011POS GOLD |
2,640 | 24.19 |
RFQ |
Datasheet |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
8080-1G24CONN SOCKET TRANSIST TO-3 3POS |
3,749 | 16.33 |
RFQ |
Datasheet |
Bulk | - | Active | Transistor, TO-3 | 3 (Round) | - | Tin-Lead | 20.0µin (0.51µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | 20.0µin (0.51µm) | Beryllium Copper | Diallyl Phthalate (DAP) |
|
840-AG11D-ESL-LFCONN IC DIP SOCKET 40POS GOLD |
2,913 | 5.48 |
RFQ |
Datasheet |
Tube | 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1571994-2CONN SOCKET SIP 2POS GOLD |
2,291 | 0.35 |
RFQ |
Datasheet |
Bulk | 510 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester |
|
|
1814655-7CONN SOCKET SIP 10POS GOLD |
2,651 | 0.65 |
RFQ |
Datasheet |
Bulk | - | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester |
|
|
506-AG11D-ESLCONN IC DIP SOCKET 6POS GOLD |
2,988 | 1.23 |
RFQ |
Datasheet |
Tube | 500 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | Polyester |
|
832-AG11D-ESLCONN IC DIP SOCKET 32POS GOLD |
3,162 | 1.95 |
RFQ |
Datasheet |
Tube | 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
