PLUS Member
Cart
All Categories

Categories

Sockets for ICs, Transistors(21991)

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-306-61-006000

116-43-306-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,245 19.57

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-306-61-006000

116-93-306-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,392 19.57

RFQ

Tube * Active - - - - - - - - - - - - - -
510-93-012-05-001002

510-93-012-05-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,224 19.57

RFQ

510-93-012-05-001002

Datasheet

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-012-05-001003

510-93-012-05-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,942 19.57

RFQ

510-93-012-05-001003

Datasheet

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6570-10

32-6570-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

3,041 19.58

RFQ

32-6570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6571-10

32-6571-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2,376 19.58

RFQ

32-6571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6572-10

32-6572-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2,760 19.58

RFQ

32-6572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6573-10

32-6573-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2,671 19.58

RFQ

32-6573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6575-10

32-6575-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

3,073 19.58

RFQ

32-6575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
38-6823-90

38-6823-90

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,354 19.58

RFQ

38-6823-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-81000-610C

28-81000-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,552 19.60

RFQ

28-81000-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-81010-610C

28-81010-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,698 19.60

RFQ

28-81010-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-81250-610C

28-81250-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,834 19.60

RFQ

28-81250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8240-610C

28-8240-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,078 19.60

RFQ

28-8240-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8250-610C

28-8250-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,884 19.60

RFQ

28-8250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8300-610C

28-8300-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,188 19.60

RFQ

28-8300-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8350-610C

28-8350-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,289 19.60

RFQ

28-8350-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8370-610C

28-8370-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,882 19.60

RFQ

28-8370-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8375-610C

28-8375-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,542 19.60

RFQ

28-8375-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8400-610C

28-8400-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,062 19.60

RFQ

28-8400-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Records«Prev1... 547548549550551552553554...1100Next»
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER