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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
14-8770-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2,199	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8800-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2,722	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8810-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	3,012	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8825-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2,893	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8860-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	3,428	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8870-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2,464	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8875-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2,035	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8910-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2,782	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8940-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	3,805	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-8960-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2,678	10.98	RFQ	PDF	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
32-3513-11 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3,319	11.00	RFQ	PDF	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-6511-11 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3,043	11.01	RFQ	PDF	Bulk	511	Active	DIP, 0.6 (15.24mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
09-7970-11 CONN SOCKET SIP 9POS GOLD Aries Electronics	3,261	11.02	RFQ	PDF	Bulk	700 Elevator Strip-Line™	Active	SIP	9 (1 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
24-0508-20 CONN SOCKET SIP 24POS GOLD Aries Electronics	3,174	11.02	RFQ	PDF	Bulk	508	Active	SIP	24 (1 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
24-0508-30 CONN SOCKET SIP 24POS GOLD Aries Electronics	2,086	11.02	RFQ	PDF	Bulk	508	Active	SIP	24 (1 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
24-1508-20 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,910	11.02	RFQ	PDF	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
24-1508-30 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,289	11.02	RFQ	PDF	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
40-6501-30 CONN IC DIP SOCKET 40POS TIN Aries Electronics	2,718	11.03	RFQ	-	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
14-0503-21 CONN SOCKET SIP 14POS GOLD Aries Electronics	2,722	11.03	RFQ	PDF	Bulk	0503	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled
14-0503-31 CONN SOCKET SIP 14POS GOLD Aries Electronics	3,455	11.03	RFQ	PDF	Bulk	0503	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled