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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
18-3518-101 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	2,843	5.45	RFQ	PDF	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-0513-11H CONN SOCKET SIP 16POS GOLD Aries Electronics	2,746	5.48	RFQ	PDF	Bulk	0513	Active	SIP	16 (1 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-11 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3,182	5.51	RFQ	PDF	Bulk	518	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-11 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3,850	5.51	RFQ	PDF	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
12-3513-11H CONN IC DIP SOCKET 12POS GOLD Aries Electronics	3,702	5.53	RFQ	PDF	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
21-0518-00 CONN SOCKET SIP 21POS GOLD Aries Electronics	3,623	5.53	RFQ	PDF	Bulk	518	Active	SIP	21 (1 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
30-1518-11 CONN IC DIP SOCKET 30POS GOLD Aries Electronics	3,012	5.53	RFQ	PDF	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	30 (2 x 15)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
44-1518-10 CONN IC DIP SOCKET 44POS GOLD Aries Electronics	2,191	5.53	RFQ	PDF	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
30-0518-11 CONN SOCKET SIP 30POS GOLD Aries Electronics	3,919	5.55	RFQ	PDF	Bulk	518	Active	SIP	30 (1 x 30)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
37-0518-10H CONN SOCKET SIP 37POS GOLD Aries Electronics	3,023	5.55	RFQ	PDF	Bulk	518	Active	SIP	37 (1 x 37)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-9513-11 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3,233	5.58	RFQ	PDF	Bulk	Lo-PRO®file, 513	Active	DIP, 0.9 (22.86mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
30-3513-10T CONN IC DIP SOCKET 30POS GOLD Aries Electronics	2,129	5.58	RFQ	PDF	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	30 (2 x 15)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10H CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,572	5.60	RFQ	PDF	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-6501-20 CONN IC DIP SOCKET 10POS TIN Aries Electronics	2,600	5.62	RFQ	PDF	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
10-6501-30 CONN IC DIP SOCKET 10POS TIN Aries Electronics	3,992	5.62	RFQ	PDF	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
32-6513-10 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3,408	5.64	RFQ	PDF	Bulk	Lo-PRO®file, 513	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
04-0501-21 CONN SOCKET SIP 4POS GOLD Aries Electronics	3,142	5.65	RFQ	PDF	Bulk	501	Active	SIP	4 (1 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
04-0501-31 CONN SOCKET SIP 4POS GOLD Aries Electronics	3,691	5.65	RFQ	PDF	Bulk	501	Active	SIP	4 (1 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
09-0503-20 CONN SOCKET SIP 9POS GOLD Aries Electronics	3,029	5.65	RFQ	PDF	Bulk	0503	Active	SIP	9 (1 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA), Nylon, Glass Filled
09-0503-30 CONN SOCKET SIP 9POS GOLD Aries Electronics	2,070	5.65	RFQ	PDF	Bulk	0503	Active	SIP	9 (1 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA), Nylon, Glass Filled