Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors

Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
84-PRS10003-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,437	76.92	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS11032-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,727	76.92	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS12022-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,325	76.92	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS13053-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,445	76.92	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS13125-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,250	76.92	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
18-PRS17041-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,532	78.44	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PRS15057-12 ZIF PGA SOCKET 56PIN 15X15 Aries Electronics	3,488	78.54	RFQ	-	-	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PLS14031-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,845	78.54	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PLS15057-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,763	78.54	RFQ	PDF	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PRS14031-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,278	78.54	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
44-6552-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	3,103	78.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3554-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,682	78.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6553-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,098	78.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3551-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,446	78.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3552-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	3,933	78.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3553-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,330	78.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6551-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	3,848	78.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6554-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,252	78.91	RFQ	PDF	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
85-PRS11008-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,718	77.11	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
101-PRS13022-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,001	79.93	RFQ	PDF	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)