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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
24-4508-21CONN IC DIP SOCKET 24POS GOLD |
2,994 | 27.60 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-4508-31CONN IC DIP SOCKET 24POS GOLD |
3,893 | 27.60 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6508-21CONN IC DIP SOCKET 24POS GOLD |
2,996 | 27.67 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6508-31CONN IC DIP SOCKET 24POS GOLD |
2,254 | 27.67 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-3551-11CONN IC DIP SOCKET ZIF 40POS GLD |
3,350 | 27.86 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
40-3552-11CONN IC DIP SOCKET ZIF 40POS GLD |
3,484 | 27.86 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
40-3553-11CONN IC DIP SOCKET ZIF 40POS GLD |
3,368 | 27.86 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
40-6551-11CONN IC DIP SOCKET ZIF 40POS GLD |
2,388 | 27.86 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
40-6552-11CONN IC DIP SOCKET ZIF 40POS GLD |
3,837 | 27.86 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
40-6553-11CONN IC DIP SOCKET ZIF 40POS |
2,022 | 27.86 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
40-3554-11CONN IC DIP SOCKET ZIF 40POS GLD |
2,599 | 27.86 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
38-0508-21CONN SOCKET SIP 38POS GOLD |
2,928 | 27.86 |
RFQ |
Datasheet |
Bulk | 508 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
38-0508-31CONN SOCKET SIP 38POS GOLD |
2,842 | 27.86 |
RFQ |
Datasheet |
Bulk | 508 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
38-1508-21CONN IC DIP SOCKET 38POS GOLD |
3,912 | 27.90 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 38 (2 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
38-1508-31CONN IC DIP SOCKET 38POS GOLD |
3,323 | 27.90 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 38 (2 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
32-3570-11CONN IC DIP SOCKET ZIF 32POS GLD |
2,879 | 27.93 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
32-3571-11CONN IC DIP SOCKET ZIF 32POS GLD |
2,426 | 27.93 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
32-3572-11CONN IC DIP SOCKET ZIF 32POS GLD |
3,494 | 27.93 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
32-3573-11CONN IC DIP SOCKET ZIF 32POS GLD |
2,192 | 27.93 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
32-3575-11CONN IC DIP SOCKET ZIF 32POS |
2,478 | 27.93 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
