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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
30-6503-31

30-6503-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,191 23.96

RFQ

30-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6823-90

48-6823-90

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,968 23.99

RFQ

48-6823-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-0511-11

28-0511-11

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3,719 24.01

RFQ

28-0511-11

Datasheet

Bulk 511 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-C182-20

32-C182-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,690 24.01

RFQ

32-C182-20

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C182-30

32-C182-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,295 24.01

RFQ

32-C182-30

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-20

32-C212-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,403 24.01

RFQ

32-C212-20

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-30

32-C212-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,132 24.01

RFQ

32-C212-30

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-20

32-C300-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,448 24.01

RFQ

32-C300-20

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-30

32-C300-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,846 24.01

RFQ

32-C300-30

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6820-90C

48-6820-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,933 24.03

RFQ

48-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6822-90C

48-6822-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,588 24.03

RFQ

48-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6823-90C

48-6823-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,143 24.03

RFQ

48-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6621-30

40-6621-30

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

2,784 24.07

RFQ

40-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-3503-21

30-3503-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,978 24.14

RFQ

30-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-3503-31

30-3503-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,698 24.14

RFQ

30-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
33-0508-21

33-0508-21

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2,026 24.25

RFQ

33-0508-21

Datasheet

Bulk 508 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
33-0508-31

33-0508-31

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2,172 24.25

RFQ

33-0508-31

Datasheet

Bulk 508 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
32-0511-11

32-0511-11

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2,645 24.27

RFQ

32-0511-11

Datasheet

Bulk 511 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
39-0501-21

39-0501-21

CONN SOCKET SIP 39POS GOLD

Aries Electronics

3,434 24.35

RFQ

39-0501-21

Datasheet

Bulk 501 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
39-0501-31

39-0501-31

CONN SOCKET SIP 39POS GOLD

Aries Electronics

3,808 24.35

RFQ

39-0501-31

Datasheet

Bulk 501 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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