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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
241-22-1-03CONN IC DIP SOCKET 22POS TIN |
3,736 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
241-24-1-06CONN IC DIP SOCKET 24POS TIN |
3,520 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
241-28-1-06CONN IC DIP SOCKET 28POS TIN |
2,389 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
241-32-1-06CONN IC DIP SOCKET 32POS TIN |
3,387 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
241-40-1-06CONN IC DIP SOCKET 40POS TIN |
3,767 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
243-48-1-06CONN IC DIP SOCKET 48POS TIN |
2,674 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
245-22-1-03CONN IC DIP SOCKET 22POS TIN |
2,068 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
212-1-06-003CONN IC DIP SOCKET 6POS GOLD |
2,320 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-08-003CONN IC DIP SOCKET 8POS GOLD |
3,394 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-14-003CONN IC DIP SOCKET 14POS GOLD |
2,011 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-16-003CONN IC DIP SOCKET 16POS GOLD |
3,873 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-18-003CONN IC DIP SOCKET 18POS GOLD |
3,332 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-20-003CONN IC DIP SOCKET 20POS GOLD |
3,041 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-24-006CONN IC DIP SOCKET 24POS GOLD |
3,208 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-28-006CONN IC DIP SOCKET 28POS GOLD |
2,919 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-32-006CONN IC DIP SOCKET 32POS GOLD |
2,972 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-40-006CONN IC DIP SOCKET 40POS GOLD |
2,100 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-48-006CONN IC DIP SOCKET 48POS GOLD |
3,586 | 0.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
241-48-1-06CONN IC DIP SOCKET 48POS TIN |
3,631 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
