Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | FlatFlexType | MountingType | Connector/ContactType | NumberofPositions | Pitch | Termination | FFCFCBThickness | HeightAboveBoard | LockingFeature | CableEndType | ContactMaterial | ContactFinish | HousingMaterial | ActuatorMaterial | Features | VoltageRating | OperatingTemperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
FA5S026HP1R3000CONN FPC BOTTOM 26POS 0.50MM R/A |
3,349 | 2.48 |
RFQ |
![]() Datasheet |
Tape & Reel (TR) | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 26 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FF0829SA1-R3000CONN FPC BOTTOM 29POS 0.20MM R/A |
3,639 | 3.53 |
RFQ |
![]() Datasheet |
Tape & Reel (TR) | FF08 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 29 | 0.008 (0.20mm) | Solder | 0.15mm | 0.039 (1.00mm) | Flip Lock | Tabbed | Copper Alloy | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FA5S018HP1CONN FPC BOTTOM 18POS 0.50MM R/A |
3,379 | 3.59 |
RFQ |
![]() Datasheet |
Tray | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5B010HP1CONN FPC BOTTOM 10POS 0.50MM SMD |
2,993 | 3.65 |
RFQ |
![]() Datasheet |
Bulk | FA5 | Active | FPC | Board Edge, Cutout | Contacts, Bottom | 10 | 0.020 (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FF0841SA1-R3000CONN FPC BOTTOM 41POS 0.20MM R/A |
2,251 | 3.71 |
RFQ |
![]() Datasheet |
Tape & Reel (TR) | FF08 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 41 | 0.008 (0.20mm) | Solder | 0.15mm | 0.039 (1.00mm) | Flip Lock | Tabbed | Copper Alloy | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FA5B030HP1R3000CONN FPC BOTTOM 30POS 0.50MM SMD |
3,330 | 4.27 |
RFQ |
![]() Datasheet |
Tape & Reel (TR) | FA5 | Active | FPC | Board Edge, Cutout | Contacts, Bottom | 30 | 0.020 (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5S010HP1CONN FPC BOTTOM 10POS 0.50MM R/A |
3,324 | 4.37 |
RFQ |
![]() Datasheet |
Tray | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FA5S050HP1R3000CONN FPC BOTTOM 50POS 0.50MM R/A |
3,162 | 4.57 |
RFQ |
![]() Datasheet |
Tape & Reel (TR) | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 50 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FA5S006HP1CONN FPC BOTTOM 6POS 0.50MM R/A |
3,324 | 4.91 |
RFQ |
![]() Datasheet |
Tray | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5S022HP1CONN FPC BOTTOM 22POS 0.50MM R/A |
3,604 | 5.13 |
RFQ |
![]() Datasheet |
Bulk | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FA5B016HP1CONN FPC BOTTOM 16POS 0.50MM SMD |
3,581 | 5.17 |
RFQ |
![]() Datasheet |
Bulk | FA5 | Active | FPC | Board Edge, Cutout | Contacts, Bottom | 16 | 0.020 (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5S016HP1CONN FPC BOTTOM 16POS 0.50MM R/A |
2,352 | 5.19 |
RFQ |
![]() Datasheet |
Bulk | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 16 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FA5B020HP1CONN FPC BOTTOM 20POS 0.50MM SMD |
3,765 | 5.28 |
RFQ |
![]() Datasheet |
Tray | FA5 | Active | FPC | Board Edge, Cutout | Contacts, Bottom | 20 | 0.020 (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5S020HP1CONN FPC BOTTOM 20POS 0.50MM R/A |
3,603 | 5.49 |
RFQ |
![]() Datasheet |
Tray | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5B008HP1CONN FPC BOTTOM 8POS 0.50MM SMD |
2,668 | 5.59 |
RFQ |
![]() Datasheet |
Bulk | FA5 | Active | FPC | Board Edge, Cutout | Contacts, Bottom | 8 | 0.020 (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5S024HP1CONN FPC BOTTOM 24POS 0.50MM R/A |
2,352 | 6.48 |
RFQ |
![]() Datasheet |
Bulk | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5B030HP1CONN FPC BOTTOM 30POS 0.50MM SMD |
2,918 | 6.85 |
RFQ |
![]() Datasheet |
Tray | FA5 | Active | FPC | Board Edge, Cutout | Contacts, Bottom | 30 | 0.020 (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
|
FA5S030HP1CONN FPC BOTTOM 30POS 0.50MM R/A |
3,768 | 7.06 |
RFQ |
![]() Datasheet |
Tray | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 30 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FA5S036HP1CONN FPC BOTTOM 36POS 0.50MM R/A |
2,041 | 7.96 |
RFQ |
![]() Datasheet |
Tray | FA5 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 36 | 0.020 (0.50mm) | Solder | 0.30mm | 0.057 (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |
![]() |
FF0396SA1-R2000CONN FPC BOTTOM 96POS 0.50MM R/A |
3,982 | 8.28 |
RFQ |
![]() Datasheet |
Tape & Reel (TR) | FF03 | Active | FPC | Surface Mount, Right Angle | Contacts, Bottom | 96 | 0.020 (0.50mm) | Solder | 0.30mm | 0.079 (2.00mm) | Rotary Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C |